Semiconductor package having interlocking heat sinks and method of fabrication

A semiconductor package comprising:

• a semiconductor die comprising a first side and a second side;
• a plurality of external leads in electrical communication with the die configured for attachment to a substrate;
• a first heat sink attached to the first side comprising a first contact surface;
• a second heat sink attached to the second side comprising a second contact surface;
• the first heat sink and the second heat sink comprising complementary elements of an interlocking structure configured with the external leads attached to the substrate to maintain the first contact surface or the second contact surface in physical contact with a heat sink on a second package attached to the substrate substantially identical to the package, to provide a thermal path between the package and the second package.

A semiconductor package comprising:

• a semiconductor die comprising a face and a back side;
• a package body at least partially encapsulating the die;
• a first heat sink in thermal communication with the face and projecting from the body;
• and
• a second heat sink in thermal communication with the back side and projecting from the body, the second heat sink configured to physically engage a heat sink substantially similar to the first heat sink on a second package substantially similar to the package to form an interlocking structure and to provide a thermal path between the second package and the package.

A semiconductor package comprising:

• a semiconductor die comprising a face, a back side, and a plurality of bond pads on the face;
• a lead frame attached to the face comprising a plurality of lead fingers in electrical communication with the bond pads and forming a plurality of terminal leads;
• a first heat sink attached to the face and a first thermally conductive adhesive layer attaching the first heat sink to the face, the first heat sink oriented generally orthogonally to the face and proximate to a first half of the die;
• and
• a second heat sink attached to the back side of the die and a second thermally conductive adhesive layer attaching the second heat sink to the back side, the second heat sink oriented generally orthogonally to the back side and proximate to a second half of the die,
• the first heat sink and the second heat sink configured as complimentary elements of an interlocking structure such that with the terminal leads attached to a substrate the first heat sink or the second heat sink is in thermal communication with a heat sink on a second package on the substrate substantially identical to the package.

A semiconductor package comprising:

• a semiconductor die comprising a back side, a face, and a plurality of bond pads on the face;
• a lead frame comprising a plurality of lead fingers attached to the face of the die in electrical communication with the bond pads;
• a package body at least partially encapsulating the die and at least a portion of the lead frame;
• a first heat sink attached to the face generally perpendicular to the face and the lead frame, the first heat sink comprising a first plate projecting from a first surface of the body;
• and
• a second heat sink attached to the back side generally perpendicular to the back side and the lead frame, the second heat sink comprising a second metal plate projecting from a second surface of the body and configured to physically engage a heat sink substantially similar to the first heat sink contained on a second package substantially similar to the package to provide an interlocking structure and a thermal path between the second package and the package.

A semiconductor package comprising:

• a semiconductor die comprising a back side, a face, and a plurality of bond pads on the face;
• a lead frame comprising a plurality of lead fingers attached to the face of the die;
• a plurality of wires bonded to the bond pads and to the lead fingers;
• a thermally conductive adhesive encapsulating the face, the back side, the wires and at least a portion of the lead frame;
• a first heat sink attached to the face by the thermally conductive adhesive;
• and
• a second heat sink attached to the back side by the thermally conductive adhesive.

An electronic assembly comprising:

• a substrate comprising a plurality of contacts;
• a first semiconductor package on the substrate comprising a die, a body encapsulating the die, a plurality of terminal leads in electrical communication with the die and attached to the contacts on the substrate, a first heat sink projecting from a first surface of the body in thermal communication with the die, and a second heat sink projecting from an opposing second surface of the body in thermal communication with the die;
• and
• a second semiconductor package on the substrate proximate to the first semiconductor package, the second semiconductor package substantially similar to the first semiconductor package and comprising a third heat sink substantially similar to the first heat sink physically contacting the second heat sink on the first semiconductor package to provide an interlocking structure and a thermal path between the first semiconductor package and the second semiconductor package.

An electronic assembly comprising:

• a substrate comprising a plurality of contacts;
• a plurality of semiconductor packages mounted to the substrate, each package comprising:
• a semiconductor die;
• a body encapsulating the die;
• a plurality of terminal leads in electrical communication with the die and in physical and electrical contact with the contacts on the substrate;
• a first heat sink attached to the die and projecting from a first side of the body;
• and
• a second heat sink attached to the die and projecting from an opposing second side of the body, the second heat sink configured to physically engage the first heat sink on an adjacent package to provide an interlocking structure and a thermal path to the adjacent package.

A method for fabricating a semiconductor package comprising:

• providing a semiconductor die comprising a face and a back side;
• providing a first heat sink and a second heat sink comprising complimentary elements configured to form an interlocking structure and provide a thermal path between the package and a second package substantially identical to the package;
• attaching the first heat sink to the die in thermal communication with the face;
• attaching the second heat sink to the die in thermal communication with the back side;
• and
• molding a plastic body to the leadframe to encapsulate the die leaving at least a first end portion of the first heat sink and a second end portion of the second heat sink exposed.

A method for fabricating a semiconductor package comprising:

• providing a semiconductor die comprising a face and a back side;
• attaching a first heat sink to the face using a first conductive adhesive layer, the first heat sink oriented generally orthogonally to the face and having a first contact surface;
• attaching a second heat sink to the back side using a second adhesive layer, the second heat sink oriented generally orthogonally to the back side and having a second contact surface configured for physical contact with a contact surface of a heat sink substantially similar to the first heat sink contained on a second package substantially similar to the package to provide an interlocking structure and a thermal path between the second package and the package;
• and
• molding a plastic body to the leadframe to encapsulate the die leaving the first contact surface and the second contact surface exposed.