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US 11,212,908 B2Granted
Semiconductor apparatus
AssigneeMitsubishi Electric Corporation
InventorsYuki Hata, Akira Yamamoto, Shintaro Araki
Life of this patent
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Abstract
A semiconductor apparatus includes a metal body in which a through hole is formed, a socket that covers the metal body without closing the through hole, a connection terminal connected to the metal body and exposed to an outside of the socket, a control board having a metal pattern and a circuit pattern, and a semiconductor chip having a control terminal connected to the circuit pattern via the through hole without being in contact with the metal body, the connection terminal being connected to the metal pattern.
Claims20
A semiconductor apparatus comprising:
- a metal body in which a through hole is formed;
- a socket that covers the metal body without closing the through hole;
- at least one connection terminal connected to the metal body and exposed to an outside of the socket;
- a control board having a metal pattern and a circuit pattern;
- and
- a semiconductor chip having a control terminal connected to the circuit pattern via the through hole without being in contact with the metal body, the at least one connection terminal being connected to the metal pattern.
3 more elements
Dependencies are inferred from the claim text.