Integrated circuit package alignment feature

A method for testing an integrated circuit package, the method comprising the steps of:

• providing an integrated circuit package including:
• a lead frame including a plurality of conductors and at least one alignment tab;
• a semiconductor die electrically coupled with at least some of the conductors of the lead frame;
• insulating material encompassing the semiconductor die and a portion of the lead frame with the plurality of conductors and the at least one alignment tab extending outwardly exterior to the insulating material;
• coupling the at least one alignment tab with an alignment structure on testing equipment such that the at least one alignment tab is electrically isolated from the plurality of conductors;
• electrically testing the integrated circuit package through at least some of the electrically coupled conductors;
• and
• removing the integrated circuit package from the testing equipment.

A method for testing an integrated circuit package, the method comprising the steps of:

• providing an integrated circuit including:
• a plurality of conductors and at least one alignment feature electrically isolated from the plurality of conductors;
• a semiconductor die coupled with the plurality of conductors;
• insulating material encompassing a portion of the plurality of conductors with the at least one alignment feature exposed;
• engaging the at least one exposed alignment feature with an alignment structure on testing equipment;
• electrically testing the integrated circuit through at least some of the conductors;
• and
• removing the integrated circuit from the testing equipment.