H05K 2201/10712
Via grid array
Official title: Via grid array, e.g. via grid array capacitor
H05K2201/10712 (Via grid array) appears on 45 US grants and 59 published applications in this corpus.
Search patents in H05K- Granted patents
- 45
- Published applications
- 59
- Assignees
- 19
- Inventors
- 103
- Latest grant
- 13 May 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2005 | 0 | 1 |
| 2006 | 1 | 3 |
| 2007 | 0 | 12 |
| 2008 | 3 | 11 |
| 2009 | 6 | 3 |
| 2010 | 6 | 6 |
| 2011 | 8 | 5 |
| 2012 | 5 | 1 |
| 2013 | 3 | 2 |
| 2014 | 3 | 0 |
| 2015 | 1 | 1 |
| 2016 | 0 | 1 |
| 2017 | 0 | 1 |
| 2018 | 1 | 3 |
| 2019 | 1 | 1 |
| 2020 | 3 | 0 |
| 2021 | 2 | 3 |
| 2022 | 1 | 1 |
| 2023 | 0 | 1 |
| 2024 | 0 | 0 |
| 2025 | 1 | 0 |
| 2026 | 0 | 3 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- Printed circuit board connector and module device comprising same13 May 2025US 12,300,917 B2LG Innotek Co., Ltd.
- Systems and methods for providing a soldered interface on a printed circuit board having a blind feature12 Jul 2022US 11,387,617 B2Eagle Technology, LLC
- Distributed auxiliary hub for a portable electronic device27 Jul 2021US 11,073,872 B2Apple Inc.
- Systems and methods for providing a soldered interface on a printed circuit board having a blind feature6 Jul 2021US 11,056,850 B2Eagle Technology, LLC
- Array type discrete decoupling under BGA grid11 Aug 2020US 10,743,408 B2Alcatel Lucent
- Via assembly for printed circuit board18 Jun 2026US 2026/0173255 A1Cisco Technology, Inc.
- High-density decoupling capacitor routing optimizing capacitance with consideration for high-yield manufacturing19 Mar 2026US 2026/0082484 A1Nokia Solutions and Networks Oy
- Multi-layer circuit board for closely packed light-emitting diode (led) arrays and method of manufacture8 Jan 2026US 2026/0013041 A1Lumileds LLC
- Printed circuit board having a differential pair routing topology with negative plane routing and impedance correction structures29 Jun 2023US 2023/0209726 A1Infinera Corporation
- Printed circuit board connector and module device comprising same1 Dec 2022US 2022/0384969 A1LG Innotek Co., Ltd.
Most cited
By later US patents
- Wiring board55US 7,808,799 B2Ngk Spark Plug Co., Ltd. · 2010
- Intermediate substrate37US 7,002,075 B2Ngk Spark Plug Co., Ltd. · 2006
- Wiring board and method for manufacturing the same24US 7,525,814 B2Ngk Spark Plug Co., Ltd. · 2009
- Component built-in wiring substrate and manufacturing method thereof22US 8,183,465 B2Ngk Spark Plug Co., Ltd. · 2012
- Ceramic package substrate with recessed device20US 8,264,846 B2Intel Corporation · 2012