Systems and methods for providing a soldered interface on a printed circuit board having a blind feature

A circuit board, comprising:

• a substrate;
• a blind via comprising a plated contact cavity formed in the substrate;
• a pad disposed on the substrate so as to at least partially surround the plated contact cavity;
• a first solder component formed of a first solder paste (i) completely filling the blind via and (ii) solidified after being applied to the plated contact cavity;
• a second solder component formed of a second solder paste solidified after being applied (a) over the plated contact cavity which is filled with the first solder paste and (b) over at least a portion of the pad;
• and
• a connector pin inserted in the plated contact cavity such that the connector pin passes through the second solder component and extends at least partially through the first solder component.

A circuit board, comprising:

• a substrate;
• a plated contact cavity formed in the substrate;
• a pad disposed on the substrate so as to at least partially surround the plated contact cavity;
• a first solder applied to the plated contact cavity using a jet paste dispenser;
• and
• a second solder applied using a stencil screen printer (a) over the plated contact cavity which is at least partially filled with the first solder and (b) over at least a portion of the pad;
• wherein the substrate comprises:
• a core substrate comprising a plurality of laminated dielectric substrate layers with a first via formed therethrough,
• a first trace disposed on an exposed surface of the core substrate that is in electrical contact with the first via,
• a first High Density Interconnect (“HDI”) substrate laminated to the core substrate such that the first trace electrically connects the first via with a second via formed through the first HDI substrate,
• a second trace disposed on an exposed surface of the first HDI substrate that is in electrical contact with the second via, and
• a second HDI substrate laminated to the first HDI substrate such that the second trace electrically connects the second via to a third via formed through the second HDI substrate;
• and
• wherein the second via comprises a buried via with a central axis spatially offset from central axis of the first and third vias, and the first and second vias having diameters which are smaller than a diameter of the third via.