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US 8,264,846 B2Granted
Ceramic package substrate with recessed device
AssigneeIntel Corporation
InventorsChristopher C. Jones, David Bach, Timothe Litt, Larry Binder, Kaladhar Radhakrishnan, Cengiz A. Palanduz
Life of this patent
Estimating the term…
Abstract
A ceramic package substrate has a recess. This allows a device in that recess to be close to a die attached to the substrate's top side, for better performance. The device may be an array capacitor, an in-silicon voltage regulator, or another device or devices.
Claims18
A device, comprising:
- a first integrated circuit die;
- a package substrate, the package substrate including:
- a top surface coupled to the first integrated circuit die;
- a bottom surface;
- multiple matrix layers comprising a ceramic material;
- recess side walls extending up from the bottom surface of the package substrate and a recessed surface, the recess side walls and recessed surface defining a cavity in the bottom of the package substrate;
- and
- electrically conductive traces and vias through the matrix layers, to provide an electrically conductive pathway from the top surface to the recessed surface in the cavity;
- and
- a first electrical device in the cavity, the first electrical device chosen from the group consisting of an array capacitor, and an in-silicon voltage regulator, the first electrical device being electrically connected to the first integrated circuit die by at least some of the electrically conductive traces and vias.
7 more elements
A semiconductor device, comprising:
- a package substrate comprising a ceramic material and conductive traces in the ceramic material, the package substrate having a maximum thickness;
- a first integrated circuit die electrically connected to a top surface of the package substrate;
- and
- an array capacitor electrically coupled to the integrated circuit die by the package substrate and being a distance away from the integrated circuit die, the distance being less than the thickness of the package substrate;
- and
- wherein the array capacitor is in a recess in a bottom of the package substrate, the recess defined by side walls and a top surface, the thickness between the top surface of the recess and the top surface of the package substrate being less than the maximum thickness of the package substrate.
3 more elements
Dependencies are inferred from the claim text.