Printed circuit board having a differential pair routing topology with negative plane routing and impedance correction structures

A method for making a printed circuit board, comprising:

• prefabricating a plurality of conductive layers encompassing a breakout area including:
• a first ground layer, a first signal layer having a conductive layer within the breakout area, a second ground layer, a second signal layer having a conductive layer within the breakout area, and a third ground layer, the breakout areas of the plurality of conductive layers being aligned, the second ground layer having a void forming a differential pair, the void being an absence of conductive material, the differential pair being two parallel traces, and being separated into a first portion positioned within a routing lane of the breakout area and a second portion within a negative plane routing region outside of the breakout area, the routing lane being a contiguous space on one or more of the five layers, the differential pair having a first width and a first spacing within the breakout area and a second width and a second spacing within the negative plane routing region, with the second width greater than the first width, and the differential pair having the first signal layer forming a first ground plane and the second signal layer forming a second ground plane for the differential pair within the breakout area;
• forming a stack by interleaving the conductive layers with a filling material;
• bonding the stack to form a structure of a printed circuit board;
• forming conductive vias within the stack;
• filling any undesired cavities in the stack with filling material;
• and
• placing contacts on the structure of the printed circuit board, at least some of the contacts being electrically connected to some of the vias.