H05K 2201/10719
Land grid array [lga]
Official title: Land grid array [LGA]
H05K2201/10719 (Land grid array [lga]) appears on 391 US grants and 327 published applications in this corpus.
Search patents in H05K- Granted patents
- 391
- Published applications
- 327
- Assignees
- 160
- Inventors
- 745
- Latest grant
- 25 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1983 | 2 | 0 |
| 1984 | 0 | 0 |
| 1985 | 1 | 0 |
| 1986 | 2 | 0 |
| 1987 | 3 | 0 |
| 1988 | 5 | 0 |
| 1989 | 2 | 0 |
| 1990 | 2 | 0 |
| 1991 | 4 | 0 |
| 1992 | 4 | 0 |
| 1993 | 2 | 0 |
| 1994 | 8 | 0 |
| 1995 | 9 | 0 |
| 1996 | 4 | 0 |
| 1997 | 10 | 0 |
| 1998 | 9 | 0 |
| 1999 | 14 | 0 |
| 2000 | 12 | 0 |
| 2001 | 14 | 8 |
| 2002 | 11 | 12 |
| 2003 | 15 | 16 |
| 2004 | 18 | 17 |
| 2005 | 8 | 18 |
| 2006 | 23 | 18 |
| 2007 | 16 | 25 |
| 2008 | 17 | 23 |
| 2009 | 15 | 25 |
| 2010 | 14 | 9 |
| 2011 | 13 | 10 |
| 2012 | 11 | 8 |
| 2013 | 4 | 5 |
| 2014 | 4 | 8 |
| 2015 | 6 | 9 |
| 2016 | 8 | 13 |
| 2017 | 11 | 7 |
| 2018 | 12 | 14 |
| 2019 | 13 | 11 |
| 2020 | 10 | 11 |
| 2021 | 16 | 16 |
| 2022 | 10 | 9 |
| 2023 | 9 | 14 |
| 2024 | 9 | 6 |
| 2025 | 5 | 3 |
| 2026 | 6 | 12 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Power amplifier modules and systems containing electromagnetic bandgap isolation arrays25 Aug 2026US 12,720,668 B2NXP USA, Inc.
- Stepped package and recessed circuit board7 Jul 2026US 12,677,375 B2Intel Corporation
- Vertical power supply system and manufacturing method of connection board21 Apr 2026US 12,610,453 B2Delta Electronics (Shanghai) Co., Ltd.
- LGA socket pins for improved differential signaling performance24 Feb 2026US 12,563,686 B2Intel Corporation
- Electric assembly comprising two printed circuit boards10 Feb 2026US 12,550,260 B2Endress + Hauser GmbH + Co. KG
- Stepped trace design for impedance compensation of high-speed differential pair channels8 Oct 2026US 2026/0313784 A1Advanced Micro Devices, Inc.
- Printed circuit board hardware interface with reduced crosstalk20 Aug 2026US 2026/0247522 A1Microsoft Technology Licensing, LLC
- Circuit board assembly2 Jul 2026US 2026/0190225 A1Foxconn Interconnect Technology Limited
- Circuit module and soldered circuit module2 Jul 2026US 2026/0190230 A1Murata Manufacturing Co., Ltd.
- Electrical conductor device and method for manufacturing an electrical conductor device25 Jun 2026US 2026/0182472 A1
Most cited
By later US patents
- Sockets for electronic components and methods of connecting to electronic components453US 5,772,451 AForm Factor, Inc. · 1998
- Method of manufacturing electrical contacts, using a sacrificial member437US 5,476,211 AForm Factor, Inc. · 1995
- Method of planarizing tips of probe elements of a probe card assembly397US 5,974,662 AFormFactor, Inc. · 1999
- Flexible contact structure with an electrically conductive shell340US 5,917,707 AFormFactor, Inc. · 1999
- Method of fabricating an interconnection element335US 6,336,269 B12002