H05K 2201/10734
Ball grid array [bga]
Official title: Ball grid array [BGA]; Bump grid array
H05K2201/10734 (Ball grid array [bga]) appears on 2,303 US grants and 2,302 published applications in this corpus.
Search patents in H05K- Granted patents
- 2,303
- Published applications
- 2,302
- Assignees
- 593
- Inventors
- 4,394
- Latest grant
- 25 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1982 | 1 | 0 |
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 1 | 0 |
| 1989 | 3 | 0 |
| 1990 | 5 | 0 |
| 1991 | 7 | 0 |
| 1992 | 7 | 0 |
| 1993 | 13 | 0 |
| 1994 | 13 | 0 |
| 1995 | 24 | 0 |
| 1996 | 25 | 0 |
| 1997 | 30 | 0 |
| 1998 | 58 | 0 |
| 1999 | 68 | 0 |
| 2000 | 69 | 0 |
| 2001 | 94 | 46 |
| 2002 | 114 | 107 |
| 2003 | 119 | 118 |
| 2004 | 99 | 150 |
| 2005 | 93 | 128 |
| 2006 | 102 | 163 |
| 2007 | 97 | 134 |
| 2008 | 102 | 151 |
| 2009 | 85 | 125 |
| 2010 | 111 | 92 |
| 2011 | 85 | 64 |
| 2012 | 61 | 24 |
| 2013 | 49 | 34 |
| 2014 | 34 | 49 |
| 2015 | 33 | 58 |
| 2016 | 44 | 62 |
| 2017 | 69 | 61 |
| 2018 | 56 | 85 |
| 2019 | 66 | 81 |
| 2020 | 88 | 99 |
| 2021 | 81 | 83 |
| 2022 | 65 | 82 |
| 2023 | 65 | 88 |
| 2024 | 59 | 77 |
| 2025 | 63 | 71 |
| 2026 | 43 | 70 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
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Most cited
By later US patents
- Sockets for electronic components and methods of connecting to electronic components453US 5,772,451 AForm Factor, Inc. · 1998
- Method of manufacturing electrical contacts, using a sacrificial member437US 5,476,211 AForm Factor, Inc. · 1995
- Semiconductor device and semiconductor device unit having ball-grid-array type package structure437US 5,726,493 AFujitsu Limited · 1998
- Method of planarizing tips of probe elements of a probe card assembly397US 5,974,662 AFormFactor, Inc. · 1999
- Semiconductor device having dual electrical contact sites344US 5,157,480 AMotorola, Inc. · 1992