H05K 2201/10704
Pin grid array [pga]
Official title: Pin grid array [PGA]
H05K2201/10704 (Pin grid array [pga]) appears on 268 US grants and 196 published applications in this corpus.
Search patents in H05K- Granted patents
- 268
- Published applications
- 196
- Assignees
- 143
- Inventors
- 560
- Latest grant
- 11 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 1 | 0 |
| 1986 | 1 | 0 |
| 1987 | 8 | 0 |
| 1988 | 9 | 0 |
| 1989 | 2 | 0 |
| 1990 | 5 | 0 |
| 1991 | 6 | 0 |
| 1992 | 3 | 0 |
| 1993 | 7 | 0 |
| 1994 | 9 | 0 |
| 1995 | 6 | 0 |
| 1996 | 11 | 0 |
| 1997 | 6 | 0 |
| 1998 | 5 | 0 |
| 1999 | 12 | 0 |
| 2000 | 8 | 0 |
| 2001 | 11 | 8 |
| 2002 | 17 | 15 |
| 2003 | 15 | 20 |
| 2004 | 11 | 14 |
| 2005 | 11 | 11 |
| 2006 | 8 | 13 |
| 2007 | 7 | 15 |
| 2008 | 7 | 5 |
| 2009 | 3 | 7 |
| 2010 | 6 | 7 |
| 2011 | 4 | 4 |
| 2012 | 6 | 5 |
| 2013 | 5 | 4 |
| 2014 | 2 | 3 |
| 2015 | 2 | 3 |
| 2016 | 4 | 6 |
| 2017 | 3 | 4 |
| 2018 | 4 | 5 |
| 2019 | 5 | 7 |
| 2020 | 8 | 7 |
| 2021 | 7 | 5 |
| 2022 | 2 | 6 |
| 2023 | 7 | 8 |
| 2024 | 5 | 5 |
| 2025 | 5 | 4 |
| 2026 | 3 | 5 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Circuit board assembly with bonded conductive posts and method of manufacturing circuit board assembly11 Aug 2026US 12,707,558 B2Fuji Electric Co., Ltd.
- Package device including capacitor disposed on opposite side of die relative to substrate23 Jun 2026US 12,667,023 B2Samsung Electronics Co., Ltd.
- Circuit system and method of manufacturing a printed circuit board17 Mar 2026US 12,581,591 B2NVIDIA Corporation
- Method of plugging a pluggable processor into a PCBA11 Nov 2025US 12,469,830 B2Google Inc.
- Staggered dual-side multi-chip interconnect2 Sep 2025US 12,406,971 B2NVIDIA Corporation
- Stepped trace design for impedance compensation of high-speed differential pair channels8 Oct 2026US 2026/0313784 A1Advanced Micro Devices, Inc.
- Wiring board, electronic component mounting substrate including wiring board, and electronic module6 Aug 2026US 2026/0231323 A1KYOCERA Corporation
- Localized Soldering U&C Shape with Metal Pin Design19 Feb 2026US 2026/0052633 A1Apple Inc.
- Pin arrangement structure, package substrate, and package structure29 Jan 2026US 2026/0032807 A1
- Embedded cooling systems for advanced device packaging and methods of manufacturing the same15 Jan 2026US 2026/0018490 A1
Most cited
By later US patents
- Semiconductor device having leads for mounting to a surface of a printed circuit board244US 5,067,007 AHitachi, Ltd. · 1991
- Method and system for controlling radio frequency radiation in microelectronic packages using heat dissipation structures237US 6,282,095 B1Compaq Computer Corporation · 2001
- Printed wiring board with mounted circuit element using a terminal density conversion board149US 5,936,843 AFujitsu Limited · 1999
- Inter-circuit encapsulated packaging132US 6,304,450 B1INCEP Technologies, Inc. · 2001
- Flexible cable for high-speed interconnect90US 7,148,428 B2Intel Corporation · 2006