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US 6,304,450 B1Granted
Inter-circuit encapsulated packaging
AssigneeINCEP Technologies, Inc.
InventorsJoseph Ted Dibene, II, David Hartke
Life of this patent
Estimating the term…
Abstract
An encapsulated circuit assembly and a method for making an encapsulated circuit assembly are disclosed. The assembly comprises a first printed circuit board, a second printed circuit board, and a heat transfer device. The second printed circuit board comprises a heatsink, and the heat transfer device couples between a device mounted on the first printed circuit board and the second printed circuit board for transferring heat from the device to the heatsink of the second printed circuit board.
Claims14
A circuit board assembly, comprising:
- a first circuit board;
- a second circuit board, coupled to the first circuit board, wherein at least a portion of the second circuit board is thermally coupled to a heatsink and wherein the second circuit board further comprises an area designed to transfer heat from a device mounted on the first circuit board to the heatsink;
- and
- a heat transfer device, thermally coupled between the device mounted on the first circuit board and the second circuit board, for transferring heat from the device to the heatsink.
1 more element
Dependencies are inferred from the claim text.