Circuit system and method of manufacturing a printed circuit board
AssigneeNVIDIA Corporation
InventorsMingYi Yu, Greg Bodi, Ananta Attaluri
Life of this patent
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AssigneeNVIDIA Corporation
InventorsMingYi Yu, Greg Bodi, Ananta Attaluri
Estimating the term…
A circuit system includes an integrated circuit package mounted on a first side of a printed circuit board and a power regulator connected to power terminals of the integrated circuit package through a cutout in the printed circuit board. The power regulator draws power from the printed circuit board by way of connections on a shelf region extending beyond an area of the cutout. A method of manufacturing a printed circuit board includes forming a cutout in the printed circuit board, the cutout having an area less than a footprint of an integrated circuit package, mounting the integrated circuit package over the cutout on a first side of the printed circuit board, coupling a power regulator to power terminals of the integrated circuit package through the cutout, and interfacing the power regulator to a power plane of the printed circuit board by way of a shelf region extending beyond the area of the cutout on a second side of the printed circuit board.
A circuit system comprising:
A circuit system comprising:
A method of manufacturing a printed circuit board, the method comprising:
Dependencies are inferred from the claim text.