Circuit board assembly with bonded conductive posts and method of manufacturing circuit board assembly

A method of manufacturing a semiconductor device, the method comprising:

• preparing a semiconductor chip provided with an electrode on a main surface, an insulated circuit board including an insulating board and a circuit pattern formed on a front surface of the insulating board, a plurality of conductive posts, and a printed circuit board;
• placing the printed circuit board above the insulated circuit board via a spacer, the spacer having a lower end contacting the insulated circuit board and an upper end contacting a back surface of the printed circuit board, bonding the plurality of conductive posts to the printed circuit board, and disposing lower end portions of the plurality of conductive posts via solder on at least one of a front surface of the circuit pattern or the electrode of the semiconductor chip;
• attaching a pressing member to the spacer with the printed circuit board between the pressing member and the spacer, the pressing member having a lower end contacting a front surface of the printed circuit board;
• and
• bonding the plurality of conductive posts to the circuit pattern by adding heat.

A semiconductor device, comprising:

• a semiconductor chip including an electrode on a main surface thereof;
• an insulated circuit board including an insulating board and a circuit pattern formed on a front surface of the insulating board, the circuit pattern having the semiconductor chip on a front surface thereof;
• a plurality of conductive posts, each conductive post having a lower end and an upper end opposite to each other, the lower end being bonded to at least one of the front surface of the circuit pattern or the electrode of the semiconductor chip, each conductive post extending vertically upward from a front surface of the insulated circuit board;
• a printed circuit board including a single planar insulating substrate and being bonded to the upper end of each of the plurality of conductive posts;
• a spacer disposed between the printed circuit board and the insulated circuit board, around a periphery of the insulating substrate, such that the insulating substrate of the printed circuit board overlaps the insulated circuit board in a plan view of the semiconductor device;
• and
• a pressing member disposed above the spacer with the printed circuit board interposed between the pressing member and the spacer.