Embedded cooling systems for advanced device packaging and methods of manufacturing the same

A device package comprising:

• an integrated cooling assembly comprising a semiconductor device and a cold plate directly bonded to the semiconductor device, wherein the cold plate comprises:
• a base surface;
• opposing cavity sidewalls extending downwardly from the base surface to a backside of the semiconductor device;
• an inlet opening;
• a first outlet opening;
• a second outlet opening, wherein the inlet opening is disposed between the first and second outlet openings;
• wherein:
• the base surface, the opposing cavity sidewalls, and the backside of the semiconductor device collectively define a coolant channel therebetween;
• the inlet opening, the first outlet opening and the second outlet opening are in fluid communication with the coolant channel;
• and
• the inlet opening is laterally offset from a hotspot region of the semiconductor device.

A device package comprising:

• an integrated cooling assembly comprising a semiconductor device and a cold plate directly bonded to the semiconductor device, wherein the cold plate comprises:
• a base surface;
• opposing cavity sidewalls extending downwardly from the base surface to a backside of the semiconductor device;
• an inlet opening;
• a first outlet opening;
• a second outlet opening, wherein the inlet opening is disposed between the first and second outlet openings;
• wherein:
• the base surface, the opposing cavity sidewalls, and the backside of the semiconductor device collectively define a coolant channel therebetween;
• the inlet opening, the first outlet opening and the second outlet opening are in fluid communication with the coolant channel;
• and
• a portion of the cold plate between the inlet opening and the second outlet opening is disposed above at least one of a computational core, neural core or graphical processing unit of the semiconductor device.

A device package comprising:

• an integrated cooling assembly comprising a semiconductor device and a cold plate directly bonded to the semiconductor device, wherein the cold plate comprises:
• a base surface;
• opposing cavity sidewalls extending downwardly from the base surface to a backside of the semiconductor device;
• an inlet opening;
• a first outlet opening;
• a second outlet opening, wherein the inlet opening is disposed between the first and second outlet openings;
• wherein:
• the base surface, the opposing cavity sidewalls, and the backside of the semiconductor device collectively define a coolant channel therebetween;
• the inlet opening, the first outlet opening and the second outlet opening are in fluid communication with the coolant channel;
• and
• a portion of the cold plate between the inlet opening and the second outlet opening is disposed above a hotspot region.