H05K 2201/10674
Flip chip
H05K2201/10674 (Flip chip) appears on 2,014 US grants and 2,196 published applications in this corpus.
Search patents in H05K- Granted patents
- 2,014
- Published applications
- 2,196
- Assignees
- 535
- Inventors
- 3,679
- Latest grant
- 22 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 2 | 0 |
| 1988 | 1 | 0 |
| 1989 | 2 | 0 |
| 1990 | 2 | 0 |
| 1991 | 3 | 0 |
| 1992 | 6 | 0 |
| 1993 | 7 | 0 |
| 1994 | 10 | 0 |
| 1995 | 9 | 0 |
| 1996 | 17 | 0 |
| 1997 | 15 | 0 |
| 1998 | 22 | 0 |
| 1999 | 31 | 0 |
| 2000 | 44 | 0 |
| 2001 | 54 | 35 |
| 2002 | 96 | 70 |
| 2003 | 63 | 62 |
| 2004 | 56 | 100 |
| 2005 | 49 | 105 |
| 2006 | 70 | 115 |
| 2007 | 85 | 147 |
| 2008 | 76 | 197 |
| 2009 | 80 | 218 |
| 2010 | 125 | 189 |
| 2011 | 148 | 140 |
| 2012 | 151 | 113 |
| 2013 | 137 | 75 |
| 2014 | 98 | 95 |
| 2015 | 85 | 102 |
| 2016 | 76 | 85 |
| 2017 | 81 | 70 |
| 2018 | 68 | 45 |
| 2019 | 51 | 45 |
| 2020 | 52 | 42 |
| 2021 | 25 | 34 |
| 2022 | 34 | 26 |
| 2023 | 28 | 27 |
| 2024 | 19 | 33 |
| 2025 | 20 | 17 |
| 2026 | 14 | 9 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Transmitter charging module for light detection and ranging (lidar) device22 Sep 2026US 12,745,350 B2Waymo LLC
- Power amplifier modules and systems containing electromagnetic bandgap isolation arrays25 Aug 2026US 12,720,668 B2NXP USA, Inc.
- Bump-on-trace design for enlarge bump-to-trace distance25 Aug 2026US 12,721,206 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Method for producing wiring board25 Aug 2026US 12,721,211 B2Mitsui Kinzoku Company, Limited
- Embedded passives with cavity sidewall interconnect in glass core architecture21 Jul 2026US 12,690,136 B2Intel Corporation
- Semiconductor substrate including first and second conductive posts and a plurality of first and second circuit layer pads10 Sep 2026US 2026/0271754 A1Advanced Semiconductor Engineering, Inc.
- Bandwidth enhancement for data storage devices having flip chip memory dies27 Aug 2026US 2026/0255469 A1SanDisk Technologies LLC
- Filling cracks on a substrate via9 Jul 2026US 2026/0197942 A1Micron Technology, Inc.
- Semiconductor package using flip-chip technology25 Jun 2026US 2026/0181773 A1Mediatek Inc.
- Embedded organic interposer for high bandwidth19 Mar 2026US 2026/0083016 A1Adeia Semiconductor Technologies LLC
Most cited
By later US patents
- High-density electronic package, and method for making same437US 6,376,769 B1Amerasia International Technology, Inc. · 2002
- Integrated structures and fabrication methods thereof implementing a cell phone or other electronic system387US 7,619,901 B2EPIC Technologies, Inc. · 2009
- Three-dimensional multichip module systems334US 5,111,278 A1992
- Method for fabricating semiconductor components using focused laser beam321US 6,114,240 AMicron Technology, Inc. · 2000
- Method for fabricating a semiconductor interconnect with laser machined electrical paths through substrate256US 6,107,109 AMicron Technology, Inc. · 2000