Embedded passives with cavity sidewall interconnect in glass core architecture

A method of making an electronic device, the method comprising:

• forming a cavity in a core layer of a substrate;
• plating sidewalls of the core layer that define the cavity with a conductive material;
• disposing a prefabricated passive electronic component in the cavity, wherein the prefabricated passive electronic component comprises a coax magnetic inductor layer (CMIL) structure;
• and
• forming a cavity sidewall connection in the substrate that provides electrical continuity between a first surface of the substrate and a second surface of the substrate via the conductive material on the sidewalls.

An electronic device comprising:

• a substrate including a core layer;
• a first prefabricated passive electronic component disposed in a first cavity within the core layer, wherein:
• the first cavity is defined by a first sidewall of the core layer;
• a conductive material is on the first sidewall of the core layer;
• and
• the first prefabricated passive electronic component comprises a first inductor structure;
• a second prefabricated passive electronic component disposed in a second cavity within the core layer and adjacent to the first cavity, wherein:
• the second cavity is defined by a second sidewall of the core layer;
• the conductive material is on the second sidewall of the core layer;
• and
• the second prefabricated passive electronic component comprises a second inductor structure;
• and
• a cavity sidewall connection located between the first and second cavities and providing electrical continuity between a first surface of the core layer and a second surface of the core layer through the conductive material on at least one of the first sidewall and the second sidewall of the core layer.