H05K 2201/10666
Plated through-hole for surface mounting on pcb
Official title: Plated through-hole for surface mounting on PCB
H05K2201/10666 (Plated through-hole for surface mounting on pcb) appears on 192 US grants and 118 published applications in this corpus.
Search patents in H05K- Granted patents
- 192
- Published applications
- 118
- Assignees
- 111
- Inventors
- 389
- Latest grant
- 31 Mar 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1980 | 1 | 0 |
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 2 | 0 |
| 1984 | 1 | 0 |
| 1985 | 2 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 3 | 0 |
| 1990 | 0 | 0 |
| 1991 | 6 | 0 |
| 1992 | 2 | 0 |
| 1993 | 3 | 0 |
| 1994 | 3 | 0 |
| 1995 | 5 | 0 |
| 1996 | 7 | 0 |
| 1997 | 5 | 0 |
| 1998 | 14 | 0 |
| 1999 | 16 | 0 |
| 2000 | 12 | 0 |
| 2001 | 14 | 8 |
| 2002 | 8 | 11 |
| 2003 | 12 | 7 |
| 2004 | 6 | 9 |
| 2005 | 6 | 11 |
| 2006 | 5 | 10 |
| 2007 | 10 | 7 |
| 2008 | 5 | 10 |
| 2009 | 8 | 6 |
| 2010 | 3 | 7 |
| 2011 | 5 | 5 |
| 2012 | 4 | 0 |
| 2013 | 5 | 1 |
| 2014 | 1 | 2 |
| 2015 | 3 | 2 |
| 2016 | 0 | 0 |
| 2017 | 0 | 0 |
| 2018 | 0 | 0 |
| 2019 | 0 | 0 |
| 2020 | 0 | 3 |
| 2021 | 3 | 5 |
| 2022 | 2 | 1 |
| 2023 | 2 | 4 |
| 2024 | 3 | 4 |
| 2025 | 3 | 2 |
| 2026 | 1 | 3 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Electronic device31 Mar 2026US 12,593,407 B2Kioxia Corporation
- Circuit board assembly soldering apparatus and circuit board assembly soldering method20 May 2025US 12,303,990 B2Honor Device Co., Ltd.
- Motor controller heat dissipating systems and methods4 Mar 2025US 12,245,408 B2Lyft, Inc.
- PCB production by laser systems25 Feb 2025US 12,238,862 B2IO Tech Group Ltd.
- PCB production by laser systems10 Sep 2024US 12,089,328 B2IO Tech Group Ltd.
- Semiconductor storage device and board unit18 Jun 2026US 2026/0171166 A1Kioxia Corporation
- Information processing apparatus, information processing system, writing jig, and writing method30 Apr 2026US 2026/0119443 A1Lenovo (Singapore) Pte. Ltd.
- Systems and methods for implementing an electrical circuit including an inductive tuning element19 Mar 2026US 2026/0082481 A1Advanced Micro Devices, Inc.
- Motor controller heat dissipating systems and methods18 Sep 2025US 2025/0294713 A1Lyft, Inc.
- Coverlay as printed circuit board (pcb) voltage insulator under connectors10 Jul 2025US 2025/0227854 A1Hamilton Sundstrand Corporation
Most cited
By later US patents
- Method of bonding flexible circuit to cicuitized substrate to provide electrical connection therebetween using different solders244US 5,203,075 AInernational Business Machines Corporation · 1993
- Passive interposer including at least one passive electronic component225US 5,530,288 AInternational Business Machines Corporation · 1996
- Alignment-enhancing feed-through conductors for stackable silicon-on-sapphire wafers209US 4,394,712 AGeneral Electric Company · 1983
- BGA package using PCB and tape in a die-up configuration171US 6,069,407 AVLSI Technology, Inc. · 2000
- Method of forming solder terminals for a pinless ceramic module160US 4,830,264 AInternational Business Machines Corporation · 1989