Circuit board assembly soldering apparatus and circuit board assembly soldering method

A circuit board assembly soldering apparatus, comprising:

• a base plate, a pressing plate assembly, at least two bearing seats, and at least two lasers, wherein the pressing plate assembly is oppositely provided above the base plate, the bearing seats are mounted on the base plate, and the bearing seats are located between the pressing plate assembly and the base plate;
• the bearing seats each comprise a workbench, the workbench is located on a side of the bearing seat that faces the pressing plate assembly, the workbench is configured to place the circuit board assembly, and the pressing plate assembly is configured to be pressed on the circuit board assembly located on the workbench;
• and the circuit board assembly comprises a first circuit board and a second circuit board that are stacked on the workbench in a one-to-one correspondence, and the second circuit board is located on a side of the first circuit board that faces away from the workbench;
• wherein
• the at least two bearing seats comprise at least one adjustable bearing seat, and a spacing between the workbench of the adjustable bearing seat and the base plate is adjustable;
• the at least two lasers comprise at least one first laser and at least one second laser;
• the at least one first laser is provided on a side of the pressing plate assembly that faces away from the base plate, and laser light emitted by the at least one first laser penetrates the pressing plate assembly and is irradiated onto the circuit board assembly on the workbench;
• and
• the at least one second laser is provided on a side of the pressing plate assembly that faces the base plate, and the at least one second laser is located in a gap between adjacent bearing seats.