PCB production by laser systems

A system for fabricating a printed circuit board (PCB) assembly, the system comprising:

• a substrate holder configured to hold a PCB substrate and translatable between a plurality of processing stations, said processing stations including a printing station;
• the printing station configured for laser-assisted deposition (LAD) of one or more materials by jetting respective ones of said materials individually from respective donor substrates on which said respective ones of said materials are coated or otherwise disposed;
• a curing station configured to cure by heating, infrared (IR) irradiation, or ultraviolet (UV) irradiation, deposited ones of said materials on said PCB substrate;
• and
• a drilling station configured to drill or engrave through holes and/or vias in said PCB substrate and/or layers of ones of said materials disposed thereon,
• wherein the donor substrate includes a first donor substrate and a second donor substrate, and
• wherein the printing station is configured to jet solder mask material from the first donor substrate towards the PCB substrate to form a layer of solder mask material over the PCB substrate using a laser of the printing station and to jet dots of label material from the second donor substrate onto the layer of solder mask material to form a layer of the label material on the layer of solder mask material using the laser of the printing station.

A system for fabricating a printed circuit board (PCB) assembly, the system comprising:

• a substrate holder configured to hold a PCB substrate and translatable between a plurality of processing stations, said processing stations including a printing station;
• the printing station configured for laser-assisted deposition (LAD) of one or more materials by jetting respective ones of said materials individually from respective donor substrates on which said respective ones of said materials are coated or otherwise disposed;
• a curing station configured to cure by heating, infrared (IR) irradiation, or ultraviolet (UV) irradiation, deposited ones of said materials on said PCB substrate;
• and
• a drilling station configured to drill or engrave through holes and/or vias in said PCB substrate and/or layers of ones of said materials disposed thereon,
• wherein the donor substrate includes a first donor substrate and a second donor substrate, and
• wherein the printing station is configured to jet an epoxy from the first donor substrate to form a layer of the epoxy over the PCB substrate using a laser of the printing station and to jet a solder mask material from the second donor substrate onto the layer of epoxy to form a first layer of the solder mask on the layer of epoxy using the laser of the printing station.