H05K 2201/10689
Leaded integrated circuit [ic] package
Official title: Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
H05K2201/10689 (Leaded integrated circuit [ic] package) appears on 1,405 US grants and 839 published applications in this corpus.
Search patents in H05K- Granted patents
- 1,405
- Published applications
- 839
- Assignees
- 551
- Inventors
- 2,620
- Latest grant
- 12 May 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 3 | 0 |
| 1977 | 4 | 0 |
| 1978 | 5 | 0 |
| 1979 | 2 | 0 |
| 1980 | 5 | 0 |
| 1981 | 8 | 0 |
| 1982 | 10 | 0 |
| 1983 | 6 | 0 |
| 1984 | 9 | 0 |
| 1985 | 12 | 0 |
| 1986 | 20 | 0 |
| 1987 | 12 | 0 |
| 1988 | 24 | 0 |
| 1989 | 33 | 0 |
| 1990 | 31 | 0 |
| 1991 | 42 | 0 |
| 1992 | 27 | 0 |
| 1993 | 41 | 0 |
| 1994 | 45 | 0 |
| 1995 | 58 | 0 |
| 1996 | 60 | 0 |
| 1997 | 44 | 0 |
| 1998 | 52 | 0 |
| 1999 | 60 | 0 |
| 2000 | 65 | 0 |
| 2001 | 58 | 23 |
| 2002 | 65 | 74 |
| 2003 | 52 | 76 |
| 2004 | 55 | 65 |
| 2005 | 53 | 83 |
| 2006 | 45 | 64 |
| 2007 | 51 | 93 |
| 2008 | 47 | 77 |
| 2009 | 54 | 80 |
| 2010 | 50 | 53 |
| 2011 | 44 | 24 |
| 2012 | 39 | 17 |
| 2013 | 21 | 9 |
| 2014 | 11 | 9 |
| 2015 | 12 | 8 |
| 2016 | 5 | 7 |
| 2017 | 9 | 6 |
| 2018 | 8 | 9 |
| 2019 | 8 | 7 |
| 2020 | 8 | 11 |
| 2021 | 7 | 7 |
| 2022 | 4 | 7 |
| 2023 | 6 | 8 |
| 2024 | 5 | 11 |
| 2025 | 7 | 8 |
| 2026 | 3 | 3 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Integrated circuit optical package comprising a flexible electrical connection element12 May 2026US 12,628,272 B2STMicroelectronics (Grenoble 2) SAS
- Connecting board and manufacturing method of the same10 Mar 2026US 12,575,031 B2Samsung Electro-Mechanics Co., Ltd.
- Thermally improved PCB for semiconductor power die connected by via technique and assembly using such PCB20 Jan 2026US 12,532,416 B2Mitsubishi Electric Corporation
- Printed circuit board12 Aug 2025US 12,389,552 B2Samsung Electro-Mechanics Co., Ltd.
- Circuit fabrication method that includes reconfiguration of via connections between circuit elements22 Jul 2025US 12,369,257 B1Innovium, Inc.
- Electronic chip packaging11 Jun 2026US 2026/0165178 A1STMicroelectronics International N. V.
- Motor power module clamping arrangement30 Apr 2026US 2026/0121490 A1Nidec Motor Corporation
- Circuit board and image forming apparatus5 Feb 2026US 2026/0040455 A1Canon Kabushiki Kaisha
- Display apparatus11 Dec 2025US 2025/0380359 A1Samsung Display Co., Ltd.
- Adapter for Enabling the Interchange of Integrated Circuits with Dissimilar Surface Mount Device Footprints27 Nov 2025US 2025/0365867 A1
Most cited
By later US patents
- Memory system having synchronous-link DRAM (SLDRAM) devices and controller383US 6,442,644 B1Advanced Memory International, Inc. · 2002
- Semiconductor device having dual electrical contact sites344US 5,157,480 AMotorola, Inc. · 1992
- Integrated circuit package and method of fabrication317US 6,028,365 AMicron Technology, Inc. · 2000
- Semiconductor package using terminals formed on a conductive layer of a circuit board258US 6,040,622 ASanDisk Corporation · 2000
- Leaded semiconductor device having accessible power supply pad terminals251US 5,508,556 AMotorola, Inc. · 1996