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AssigneeInnovium, Inc.
InventorsVittal Balasubramanian, Yongming Xiong, Keith Michael Ring
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In a circuit fabrication method, first, second, and third initial vias are fabricated in a circuit board. First and second conductive traces are fabricated at first and second depths in the circuit board. Either a first indication is obtained that, in a final circuit configuration, an integrated circuit is to be directly electrically connected to a first circuit element without directly electrically connecting to a second circuit element, or a second indication is obtained that, in the final circuit configuration, the integrated circuit is to be directly electrically connected to the second circuit element without directly electrically connecting to the first circuit element. In response to obtaining the first indication, a first portion of the second initial via is removed by drilling. In response to obtaining the second indication, a second portion of the second initial via is removed by drilling.
A circuit fabrication method, comprising:
Dependencies are inferred from the claim text.