Connecting board and manufacturing method of the same

A connecting board comprising:

• a core layer having a cavity in a thickness direction to pass through an inner center region of the core layer based on a plane perpendicular to the thickness direction;
• a via passing through the core layer;
• connection pads that are coupled to both ends of the via;
• and
• reinforcing members,
• wherein in the plane perpendicular to the thickness direction, one or more of the reinforcing members are spaced apart from the cavity and the connection pads, and
• the one or more of the reinforcing members are provided on at least one of both surfaces of the core layer in the thickness direction, so as to be coupled to the core layer.

A manufacturing method of a connecting board comprising:

• forming a via in a core member so as to pass through the core member in a thickness direction, and forming connection pads on both ends of the via;
• sequentially forming solder resist layers and metal thin films on both surfaces of the core member in the thickness direction;
• forming masks using the metal thin films;
• and
• forming a partition space penetrating through the core member by discontinuously cutting so as to pass between an inner region and an outer region based on a plane perpendicular to the thickness direction, so as to define the outer region as the connecting board and the inner region as a reinforcement dummy,
• wherein after forming the partition space, the core member includes a plurality of coupling ribs which extend in a same direction from one of a plurality of edges of the core member toward another of the plurality of edges of the core member.