B81B 7/0032
Packages or encapsulation
Official title: {Packages or encapsulation (processes for packaging MEMS B81C1/00261; packaging of smart-MEMS B81C1/0023)}
B81B7/0032 (Packages or encapsulation) appears on 2,698 US grants and 3,270 published applications in this corpus.
Search patents in B81B- Granted patents
- 2,698
- Published applications
- 3,270
- Assignees
- 712
- Inventors
- 4,415
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 1 | 0 |
| 1989 | 1 | 0 |
| 1990 | 0 | 0 |
| 1991 | 2 | 0 |
| 1992 | 0 | 0 |
| 1993 | 2 | 0 |
| 1994 | 1 | 0 |
| 1995 | 0 | 0 |
| 1996 | 2 | 0 |
| 1997 | 2 | 0 |
| 1998 | 3 | 0 |
| 1999 | 5 | 0 |
| 2000 | 8 | 0 |
| 2001 | 16 | 3 |
| 2002 | 24 | 50 |
| 2003 | 41 | 42 |
| 2004 | 36 | 57 |
| 2005 | 56 | 98 |
| 2006 | 50 | 76 |
| 2007 | 34 | 88 |
| 2008 | 46 | 86 |
| 2009 | 50 | 77 |
| 2010 | 57 | 98 |
| 2011 | 65 | 93 |
| 2012 | 75 | 101 |
| 2013 | 103 | 136 |
| 2014 | 135 | 177 |
| 2015 | 192 | 225 |
| 2016 | 216 | 235 |
| 2017 | 206 | 253 |
| 2018 | 182 | 210 |
| 2019 | 217 | 201 |
| 2020 | 205 | 224 |
| 2021 | 141 | 153 |
| 2022 | 129 | 139 |
| 2023 | 123 | 125 |
| 2024 | 121 | 121 |
| 2025 | 89 | 128 |
| 2026 | 59 | 74 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
- B81B 7/007Interconnections between the mems and external electrical signals791
- B81B 7/0035For maintaining a controlled atmosphere inside of the chamber containing the mems511
- B81B 7/0061Suitable for fluid transfer from the mems out of the package or453
- B81B 7/0045For reducing stress inside of the package structure404
- B81B 7/0077Other packages not provided for in groups b81b7/0035 - b81b7/0074297
- B81B 7/0058For protecting against damages due to external chemical or mechanical influences286
- B81B 7/0064For protecting against electromagnetic or electrostatic interferences232
- B81B 7/0067For controlling the passage of optical signals through the package160
All 9 subgroupsShow fewer
Recent patents
- Multiple plated via arrays of different wire heights on a same substrate6 Oct 2026US RE51,062 E1Adeia Semiconductor Technologies LLC
- Wafer level package for device29 Sep 2026US 12,747,155 B2Teknologian tutkimuskeskus VTT Oy
- Microelectromechanical systems package with a lateral vent hole connected to a cavity and method for manufacturing the same22 Sep 2026US 12,741,863 B2Vanguard International Semiconductor Corporation
- Inertial measurement unit22 Sep 2026US 12,741,864 B2Seiko Epson Corporation
- Electronic devices including device packages having a port hole with a spark arrest shoulder and related methods15 Sep 2026US 12,740,424 B2RF360 Singapore Pte. Ltd.
- Method for producing a microelectromechanical device comprising a cap structure and a microelectromechanical device8 Oct 2026US 2026/0307983 A1
- Electronic devices and methods of manufacturing electronic devices1 Oct 2026US 2026/0296878 A1Amkor Technology Singapore Holding Pte. Ltd.
- Micro-electro-mechanical system package and fabrication method thereof1 Oct 2026US 2026/0296879 A1Vanguard International Semiconductor Corporation
- Vacuum encapsulation24 Sep 2026US 2026/0285675 A1Obsidian Sensors, Inc.
- Method of fabricating micro-electro-mechanical system package24 Sep 2026US 2026/0285676 A1Vanguard International Semiconductor Corporation
Most cited
By later US patents
- Hermetic seal and method to create the same666US 6,589,625 B1Iridigm Display Corporation · 2003
- Microfluidic chip having integrated electrodes303US 6,939,451 B2Aclara Biosciences, Inc. · 2005
- Method of fabrication of a microstructure having an internal cavity302US 6,297,072 B1Interuniversitair Micro-Elktronica Centrum (IMEC VZW) · 2001
- Bi-level microelectronic device package with an integral window296US 6,674,159 B1Sandia National Laboratories · 2004
- Microelectromechanical system package with environmental and interference shield293US 6,781,231 B2Knowles Electronics, LLC · 2004