B81B 7/0061
Suitable for fluid transfer from the mems out of the package or
Official title: {suitable for fluid transfer from the MEMS out of the package or vice versa, e.g. transfer of liquid, gas, sound}
B81B7/0061 (Suitable for fluid transfer from the mems out of the package or) appears on 453 US grants and 552 published applications in this corpus.
Search patents in B81B- Granted patents
- 453
- Published applications
- 552
- Assignees
- 199
- Inventors
- 955
- Latest grant
- 15 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1996 | 1 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 1 | 0 |
| 2002 | 0 | 4 |
| 2003 | 2 | 0 |
| 2004 | 0 | 2 |
| 2005 | 4 | 6 |
| 2006 | 0 | 1 |
| 2007 | 1 | 6 |
| 2008 | 6 | 15 |
| 2009 | 5 | 6 |
| 2010 | 5 | 11 |
| 2011 | 12 | 12 |
| 2012 | 9 | 15 |
| 2013 | 20 | 19 |
| 2014 | 30 | 20 |
| 2015 | 38 | 23 |
| 2016 | 23 | 36 |
| 2017 | 22 | 47 |
| 2018 | 29 | 46 |
| 2019 | 49 | 38 |
| 2020 | 42 | 53 |
| 2021 | 37 | 37 |
| 2022 | 27 | 25 |
| 2023 | 23 | 34 |
| 2024 | 22 | 30 |
| 2025 | 26 | 41 |
| 2026 | 19 | 25 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Electronic devices including device packages having a port hole with a spark arrest shoulder and related methods15 Sep 2026US 12,740,424 B2RF360 Singapore Pte. Ltd.
- Three-dimensional printed articles and methods of manufacture25 Aug 2026US 12,714,367 B2Arizona Board of Regents on Behalf of the University of Arizona
- Low stress packaging for environmental sensors25 Aug 2026US 12,716,796 B2NXP USA, Inc.
- Micro speaker structure with acoustic mesh14 Jul 2026US 12,684,283 B2Fortemedia, Inc.
- Integrated device package with opening in carrier9 Jun 2026US 12,653,051 B2Skyworks Solutions, Inc.
- Method for producing a microelectromechanical device comprising a cap structure and a microelectromechanical device8 Oct 2026US 2026/0307983 A1
- Electronic devices and methods of manufacturing electronic devices1 Oct 2026US 2026/0296878 A1Amkor Technology Singapore Holding Pte. Ltd.
- Integrated device package with carrier17 Sep 2026US 2026/0282981 A1Skyworks Solutions, Inc.
- Wafer level chip scale packaging with sensor10 Sep 2026US 2026/0265047 A1Stmicroelectronics Pte Ltd
- Micromechanical sensor device and corresponding production method3 Sep 2026US 2026/0257909 A1
Most cited
By later US patents
- Microfluidic chip having integrated electrodes303US 6,939,451 B2Aclara Biosciences, Inc. · 2005
- Backside contact of sensor microstructures152US 5,511,428 AMassachusetts Institute of Technology · 1996
- Method of manufacturing a microphone95US 7,434,305 B2Knowles Electronics, LLC · 2008
- Silicon condenser microphone and manufacturing method91US 7,381,589 B2Knowles Electronics, LLC · 2008
- Silicon condenser microphone and manufacturing method89US 8,018,049 B2Knowles Electronics, LLC · 2011