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US 7,434,305 B2Granted
Method of manufacturing a microphone
AssigneeKnowles Electronics, LLC
InventorAnthony D. Minervini
Life of this patent
Estimating the term…
Abstract
A silicon condenser microphone package is disclosed. The silicon condenser microphone package comprises a transducer unit, substrate, and a cover. The substrate includes an upper surface having a recess formed therein. The transducer unit is attached to the upper surface of the substrate and overlaps at least a portion of the recess wherein a back volume of the transducer unit is formed between the transducer unit and the substrate. The cover is placed over the transducer unit and includes an aperture.
Claims20
A method of manufacturing a microphone comprising:
- providing a first panel comprising a plurality of bottom layer portions for a corresponding plurality of microphones;
- disposing a transducer on each of the plurality of bottom layer portions;
- securing a second panel comprising a plurality of top layer portions for the plurality of microphones to the first panel, the top layer portion enclosing the transducer within a cavity defined by the top layer portion and the bottom layer portion;
- and
- separating the plurality of microphones;
- wherein each bottom layer comprises an acoustic port having an aperture to receive an acoustic signal, and disposing the transducer comprises disposing the transducer adjacent the acoustic port.
3 more elements
A method of manufacturing a microphone comprising:
- providing a first panel comprising a plurality of bottom layer portions for a corresponding plurality of microphones;
- disposing a transducer on each of the plurality of bottom layer portions;
- securing a second panel comprising a plurality of top layer portions for the plurality of microphones to the first panel, the top layer portion enclosing the transducer within a cavity defined by the top layer portion and the bottom layer portion;
- and
- separating the plurality of microphones;
- wherein each of the bottom layers or each of the top layers comprise an acoustic port having an aperture to receive an acoustic signal, the method comprising providing an environmental barrier covering the acoustic port.
3 more elements
A method of manufacturing a microphone comprising:
- providing a first panel comprising a plurality of bottom layer portions for a corresponding plurality of microphones;
- disposing a transducer on each of the plurality of bottom layer portions;
- securing a second panel comprising a plurality of top layer portions for the plurality of microphones to the first panel, the top layer portion enclosing the transducer within a cavity defined by the top layer portion and the bottom layer portion;
- and
- separating the plurality of microphones;
- wherein separating the plurality of microphones comprises separating the plurality of microphones into microphone pairs.
3 more elements
A method of manufacturing a microphone comprising:
- providing a first panel comprising a plurality of bottom layer portions for a corresponding plurality of microphones;
- disposing a transducer on each of the plurality of bottom layer portions;
- securing a second panel comprising a plurality of top layer portions for the plurality of microphones to the first panel, the top layer portion enclosing the transducer within a cavity defined by the top layer portion and the bottom layer portion;
- and
- separating the plurality of microphones;
- wherein each of the bottom layer portions or each of the top layer portions comprise an acoustic port having an aperture to receive an acoustic signal, and disposing the transducer comprises disposing the transducer adjacent the acoustic port formed in the bottom layer portion or the top layer portion.
3 more elements
A method of manufacturing a microphone comprising:
- providing a first panel comprising a plurality of bottom layer portions for a corresponding plurality of microphones;
- disposing a transducer on each of the plurality of bottom layer portions;
- securing a second panel comprising a plurality of top layer portions for the plurality of microphones to the first panel, the top layer portion enclosing the transducer within a cavity defined by the top layer portion and the bottom layer portion;
- separating the plurality of microphones;
- and
- the first panel and the second panel comprising laminate structures, the laminate structures comprising conductive layer portions and non-conductive layer portions forming a capacitor within the top layer portions and the bottom layer portions.
3 more elements
Dependencies are inferred from the claim text.