Micromechanical sensor device and corresponding production method

A micromechanical sensor device, comprising:

• a MEMS sensor chip, which has a first upper side and a first underside;
• an ASIC chip, which has a second upper side and a second underside;
• wherein an exposed cavity (CA) is formed on the first upper side,
• wherein a sensor core of the MEMS sensor chip is elastically suspended inside the cavity via a spring device on a periphery of the cavity in the sensor chip,
• wherein the ASIC chip is bonded with the second upper side to the first upper side of the MEMS sensor chip,
• wherein a first passage opening that opens into the cavity is provided on the first underside as a media access, and
• wherein the sensor core includes at least one sensor region that is sensitive to a medium passed through the passage opening.

A production method for a micromechanical sensor device, comprising the following steps:

• providing a MEMS sensor chip, which has a first upper side and a first underside, and an ASIC chip, which has a second upper side and a second underside,
• wherein an exposed cavity is formed on the first upper side;
• wherein a sensor core of the MEMS sensor chip is elastically suspended inside the cavity via a spring device on the periphery of the cavity in the sensor chip,
• wherein a first passage opening that opens into the cavity is provided on the first underside as a media access, and
• wherein the sensor core includes at least one sensor region that is sensitive to a medium passed through the passage opening;
• and
• bonding the ASIC chip with the second upper side to the first upper side of the MEMS sensor chip.