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US 7,381,589 B2Granted
Silicon condenser microphone and manufacturing method
AssigneeKnowles Electronics, LLC
InventorAnthony D. Minervini
Life of this patent
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Abstract
A silicon condenser microphone package is disclosed. The silicon condenser microphone package comprises a transducer unit substrate, and a cover. The substrate includes an upper surface having a recess formed therein. The transducer unit is attached to the upper surface of the substrate and overlaps at least a portion of the recess wherein a back volume of the transducer unit is formed between the transducer unit and the substrate. The cover is placed over the transducer unit and includes an aperture.
Claims12
A method of manufacturing a microphone comprising:
- providing a first panel comprising a plurality of bottom layer portions for a corresponding plurality of microphones;
- providing a second panel comprising a plurality of top layer portions for the corresponding plurality of microphones;
- disposing a transducer on each of the plurality of bottom layer portions or each of the plurality of top layer portions;
- securing the first panel to the second panel to form cavities defined by each top layer portion and each bottom layer portion enclosing each transducer;
- and
- separating microphones from the joined first panel and second panel,
- wherein each of the bottom layer portions or each of the top layer portions comprising an acoustic port, the transducer being coupled via the cavity to the acoustic port.
4 more elements
Dependencies are inferred from the claim text.