B81B 7/00
Microstructural systems
Official title: Microstructural systems {; Auxiliary parts of microstructural devices or systems}
B81B7/00 (Microstructural systems) appears on 4,470 US grants and 5,446 published applications in this corpus.
Search patents in B81B- Granted patents
- 4,470
- Published applications
- 5,446
- Assignees
- 1,143
- Inventors
- 7,252
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 2 | 0 |
| 1989 | 1 | 0 |
| 1990 | 0 | 0 |
| 1991 | 2 | 0 |
| 1992 | 0 | 0 |
| 1993 | 3 | 0 |
| 1994 | 1 | 0 |
| 1995 | 1 | 0 |
| 1996 | 3 | 0 |
| 1997 | 5 | 0 |
| 1998 | 4 | 0 |
| 1999 | 12 | 0 |
| 2000 | 15 | 0 |
| 2001 | 29 | 6 |
| 2002 | 33 | 70 |
| 2003 | 53 | 77 |
| 2004 | 68 | 96 |
| 2005 | 88 | 136 |
| 2006 | 70 | 100 |
| 2007 | 47 | 117 |
| 2008 | 62 | 112 |
| 2009 | 73 | 116 |
| 2010 | 74 | 132 |
| 2011 | 98 | 130 |
| 2012 | 106 | 153 |
| 2013 | 146 | 211 |
| 2014 | 195 | 289 |
| 2015 | 296 | 364 |
| 2016 | 312 | 375 |
| 2017 | 336 | 398 |
| 2018 | 301 | 371 |
| 2019 | 367 | 378 |
| 2020 | 370 | 377 |
| 2021 | 259 | 277 |
| 2022 | 257 | 302 |
| 2023 | 240 | 241 |
| 2024 | 225 | 232 |
| 2025 | 195 | 229 |
| 2026 | 118 | 157 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
- B81B 7/0032Packages or encapsulation2,698
- B81B 7/02Containing distinct electrical or optical devices of particular relevance for their function880
- B81B 7/0009Structural features, others than packages, for protecting a device against environmental influences469
- B81B 7/0006Interconnects399
- B81B 7/008Mems characterised by an electronic circuit specially adapted for controlling or driving364
- B81B 7/0083Temperature control163
- B81B 7/04Networks or arrays of similar microstructural devices116
- B81B 7/0003Mems mechanisms for assembling automatically hinged components, self-assembly devices33
Recent patents
- Circuit for operating a capacitive sensor and sensor apparatus6 Oct 2026US 12,754,221 B2Robert Bosch GmbH
- System and method for generating an audio signal6 Oct 2026US 12,756,970 B2Sonicedge Ltd.
- Multiple plated via arrays of different wire heights on a same substrate6 Oct 2026US RE51,062 E1Adeia Semiconductor Technologies LLC
- Wafer level package for device29 Sep 2026US 12,747,155 B2Teknologian tutkimuskeskus VTT Oy
- Microelectromechanical systems package with a lateral vent hole connected to a cavity and method for manufacturing the same22 Sep 2026US 12,741,863 B2Vanguard International Semiconductor Corporation
- Micromechanical arm array for mems actuators8 Oct 2026US 2026/0307981 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Packaging method for mems acoustic device structure, mems acoustic device packaging structure and mems chip packaging method for acoustic device8 Oct 2026US 2026/0307982 A1Hefei Smat Technology Co., Ltd.
- Method for producing a microelectromechanical device comprising a cap structure and a microelectromechanical device8 Oct 2026US 2026/0307983 A1
- Semiconductor device with improved dielectric film structure and method of manufacturing same1 Oct 2026US 2026/0295637 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Mems device1 Oct 2026US 2026/0296877 A1Infineon Technologies AG
Most cited
By later US patents
- Hermetic seal and method to create the same666US 6,589,625 B1Iridigm Display Corporation · 2003
- Microfluidic chip having integrated electrodes303US 6,939,451 B2Aclara Biosciences, Inc. · 2005
- Method of fabrication of a microstructure having an internal cavity302US 6,297,072 B1Interuniversitair Micro-Elktronica Centrum (IMEC VZW) · 2001
- Bi-level microelectronic device package with an integral window296US 6,674,159 B1Sandia National Laboratories · 2004
- Microelectromechanical system package with environmental and interference shield293US 6,781,231 B2Knowles Electronics, LLC · 2004