Microelectromechanical systems package with a lateral vent hole connected to a cavity and method for manufacturing the same

A microelectromechanical systems (MEMS) package, comprising:

• a first MEMS package, comprising:
• a first device substrate comprising a first MEMS device;
• a first cap substrate bonded to the first device substrate, wherein the first cap substrate encloses a first cavity and a vent hole, the vent hole being connected to the first cavity;
• and
• a first sealing layer laterally extending into and filled in at least a portion of the vent hole, wherein the first sealing layer is disposed between a top surface of the first device substrate and a bottom surface of the first cap substrate;
• a second MEMS package laterally spaced apart from the first MEMS package, comprising:
• a second device substrate comprising a second MEMS device;
• and
• a second cap substrate bonded to the second device substrate, wherein the second cap substrate encloses a second cavity,
• wherein the first cavity has a first pressure, and the second cavity have a second pressure different from the first pressure.