Packaging method for mems acoustic device structure, mems acoustic device packaging structure and mems chip packaging method for acoustic device

A MEMS acoustic device packaging structure, comprising a first device and a second device, and further comprising:

• a redistribution layer plated inside a package body and connected to an electrical interface, a conductive block plated on a portion of the redistribution layer, with a top surface of the conductive block flush with and exposed from the package body;
• a substrate ring mounted on the package body to enclose the second device;
• and
• a cover plate mounted to seal the substrate ring, with an acoustic hole of the cover plate aligned with a middle portion of a diaphragm of the second device,
• wherein the first device is encapsulated in the package body, and the second device is electrically connected to the conductive block, so as to be vertically stacked and connected with the first device.

A MEMS chip packaging method for an acoustic device, comprising steps of:

• substrate etching:
• an electrode being provided above a substrate, a diaphragm being provided above the electrode, etching through from a middle position of a surface of the substrate away from the electrode to form a back cavity, so as to expose the electrode, with the back cavity located directly below the electrode;
• simultaneously etching through other portions of the substrate to form a circuit hole exposing the electrode;
• circuit plating:
• plating and filling metal in the circuit hole to form a circuit, with one end of the circuit electrically connected to the electrode and the other end of the circuit flush with and exposed from the surface of the substrate.