B81B 7/008
Mems characterised by an electronic circuit specially adapted for controlling or driving
Official title: {MEMS characterised by an electronic circuit specially adapted for controlling or driving the same (B81B7/0087 takes precedence; arrangements for starting, regulating, braking, or otherwise controlling an actuator H02N; control arrangements or circuits for visual indicators G09G3/00)}
B81B7/008 (Mems characterised by an electronic circuit specially adapted for controlling or driving) appears on 364 US grants and 433 published applications in this corpus.
Search patents in B81B- Granted patents
- 364
- Published applications
- 433
- Assignees
- 178
- Inventors
- 857
- Latest grant
- 21 Jul 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2003 | 1 | 0 |
| 2004 | 0 | 0 |
| 2005 | 0 | 0 |
| 2006 | 0 | 0 |
| 2007 | 0 | 1 |
| 2008 | 0 | 1 |
| 2009 | 0 | 1 |
| 2010 | 0 | 1 |
| 2011 | 2 | 5 |
| 2012 | 0 | 8 |
| 2013 | 3 | 16 |
| 2014 | 13 | 28 |
| 2015 | 25 | 40 |
| 2016 | 42 | 48 |
| 2017 | 43 | 47 |
| 2018 | 38 | 35 |
| 2019 | 40 | 32 |
| 2020 | 29 | 38 |
| 2021 | 24 | 26 |
| 2022 | 26 | 40 |
| 2023 | 22 | 17 |
| 2024 | 30 | 17 |
| 2025 | 20 | 13 |
| 2026 | 6 | 19 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- MEMS loudspeaker manufacturing method and MEMS loudspeaker21 Jul 2026US 12,686,614 B2Aac Kaitai Technologies (Wuhan) Co., Ltd
- Micromirror resonance supression using configurable filter14 Jul 2026US 12,683,585 B2Microsoft Technology Licensing, LLC
- Microelectromechanical sensor device with improved management of a power-down condition12 May 2026US 12,624,966 B2STMicroelectronics International N. V.
- Stress isolation for integrated circuit package integration28 Apr 2026US 12,612,303 B2Analog Devices, Inc.
- MEMS device with movable electrode plate and feedback capacitor21 Apr 2026US 12,606,432 B2Zhunmao (Hangzhou) Technology Co.
- Packaging method for mems acoustic device structure, mems acoustic device packaging structure and mems chip packaging method for acoustic device8 Oct 2026US 2026/0307982 A1Hefei Smat Technology Co., Ltd.
- Asic capped double layer mems platform20 Aug 2026US 2026/0242213 A1Murata Manufacturing Co., Ltd.
- Microelectromechanical sensor device with improved management of a power-down state20 Aug 2026US 2026/0243582 A1STMicroelectronics International N. V.
- Mems with synchronous movable elements13 Aug 2026US 2026/0238931 A1
- Mems component and method for producing a mems component23 Jul 2026US 2026/0209032 A1
Most cited
By later US patents
- Multichip modules and methods of fabrication66US 9,666,559 B2Invensas Corporation · 2017
- Micro-electro-mechanical systems (MEMS), systems, and operating methods thereof49US 9,236,877 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Integrated CMOS and MEMS with air dielectric method and system46US 8,421,082 B1mCube Inc. · 2013
- Electrostatically charged microstructures41US 6,597,048 B1Cornell Research Foundation, Inc. · 2003
- Noise reduction method with chopping for a merged MEMS accelerometer sensor38US 8,742,964 B2Fairchild Semiconductor Corporation · 2014