Stress isolation for integrated circuit package integration

A 3D heterogeneous packaged device, comprising:

• a substrate;
• an interposer, bonded to the substrate, comprising:
• a plurality of stress isolation platforms, at least one of the plurality of stress isolation platforms defining a portion of the interposer that is flexibly coupled to a remainder of the interposer by a plurality of stress isolation suspensions;
• and
• a bond pad formed in the at least one of the plurality of stress isolation platforms;
• a bond, in contact with the bond pad, coupling the interposer to the substrate;
• and
• a device die coupled to the interposer, wherein the interposer is disposed between the device die and the substrate.

A method for fabricating a 3D heterogeneous packaged device, comprising:

• bonding an interposer to a device die;
• patterning the interposer with a plurality of bond pads;
• forming, at different locations from the plurality of bond pads, a plurality of stress isolation platforms by etching a plurality of trenches through the interposer so that at least one of the plurality of stress isolation platforms includes a bond pad of the plurality of bond pads;
• and
• with the interposer bonded to the device die, bonding the interposer to a substrate so that the interposer is between the device die and the substrate,
• wherein a first stress isolation platform of the plurality of stress isolation platforms is flexibly coupled to the interposer by a stress isolation suspension that is formed between two or more trenches of the plurality of trenches that extend across an entire thickness of the interposer.