MEMS loudspeaker manufacturing method and MEMS loudspeaker

A micro-electro-mechanical system (MEMS) loudspeaker manufacturing method, comprising:

• positioning a printed circuit board (PCB) substrate, wherein the PCB substrate defines a first groove located on a first side of the PCB substrate and an acoustic hole passed through a second side of the PCB substrate and communicated with the first groove;
• inverting a MEMS chip and electrically connecting the MEMS chip to the first side of the PCB substrate having the first groove, wherein a projection of a vibrating diaphragm of the MEMS chip in a thickness direction falls into the first groove, and a gap is defined between the MEMS chip and the PCB substrate;
• and
• filling and solidifying a polymer protection material in the gap between the MEMS chip and the PCB substrate, comprising:
• disposing a sealing fixture on a peripheral side of the MEMS chip and a peripheral side of the PCB substrate, wherein a glue filling opening is formed between the peripheral side of the MEMS chip and an inner side of the sealing fixture, and the glue filling opening communicates with the gap;
• dot coating a liquid polymer protection material to the glue filling opening until the gap and the glue filling opening are filled;
• solidifying the liquid polymer protection material, and forming a polymer protection component within the gap and the peripheral side of the MEMS chip to combine the MEMS chip and the PCB substrate into a combination component.