25,834 results
- US 2026/0318672 A1Published 15 Oct 2026Optical device
Hamamatsu Photonics K.K.
- US 2026/0317162 A1Published 15 Oct 2026Micro-electro-mechanical system package and fabrication method thereof
Vanguard International Semiconductor Corporation
- US 2026/0317161 A1Published 15 Oct 2026Sensing device
Beijing Boe Optoelectronics Technology Co., Ltd.
- US 2026/0317160 A1Published 15 Oct 2026Microelectromechanical sensor component, microelectromechanical inertial sensor, and method for producing a microelectromechanical sensor component
Jochen Reinmuth, Andrea Urban +1inventors
- US 2026/0317159 A1Published 15 Oct 2026Coating for reduction of device mechanical and/or electrical fatigue
The Charles Stark Draper Laboratory, Inc.
- US 12,764,484 B2Granted 13 Oct 2026
- US 12,761,096 B2Granted 13 Oct 2026High temperature piezo-resistive pressure sensor and packaging assembly therefor
Rosemount Aerospace Inc.
- US 12,759,867 B2Granted 13 Oct 2026MEMS structure with reduced peeling and methods forming the same
Taiwan Semiconductor Manufacturing Company, Ltd.
- US 12,759,866 B2Granted 13 Oct 2026MEMS microphone
Aac Acoustic Technologies (Shenzhen) Co., Ltd.
- US 2026/0311937 A1Published 8 Oct 2026Capacitive rf microswitch for high-power applications
José-Paolo MARTINS, Matthieu LE BAILLIF +1inventors
- US 2026/0307983 A1Published 8 Oct 2026Method for producing a microelectromechanical device comprising a cap structure and a microelectromechanical device
Heribert Weber, Franziska Rohlfing +1inventors
- US 2026/0307982 A1Published 8 Oct 2026
- US 2026/0307981 A1Published 8 Oct 2026Micromechanical arm array for mems actuators
Taiwan Semiconductor Manufacturing Company, Ltd.
- US 2026/0307980 A1Published 8 Oct 2026
- US 12,756,970 B2Granted 6 Oct 2026System and method for generating an audio signal
Sonicedge Ltd.
- US 12,754,529 B2Granted 6 Oct 2026
- US 12,754,221 B2Granted 6 Oct 2026Circuit for operating a capacitive sensor and sensor apparatus
Robert Bosch GmbH
- US 12,753,069 B2Granted 6 Oct 2026MEMS device
Rohm Co., Ltd.
- US 12,753,068 B2Granted 6 Oct 2026Engineered substrates, free-standing semiconductor microstructures, and related systems and methods
Lawrence Semiconductor Research Laboratory, Inc.
- US 12,753,067 B2Granted 6 Oct 2026
- US 12,752,371 B1Granted 6 Oct 2026Femtosecond laser surface processing for controlled fill and targeted deposition
Honeywell Federal Manufacturing & Technologies, LLC
- US RE51,062 E1Granted 6 Oct 2026Multiple plated via arrays of different wire heights on a same substrate
Adeia Semiconductor Technologies LLC
- US 2026/0299283 A1Published 1 Oct 2026Systems and methods to reduce stiction in mems devices
Texas Instruments Incorporated
- US 2026/0296882 A1Published 1 Oct 2026Method for manufacturing a microelectromechanical component, and microelectromechanical component
Marcus Pritschow, Raphael Schulerinventors
- US 2026/0296880 A1Published 1 Oct 2026Wafer level proximity sensor and method of making same
STMicroelectronics International N.V.