B81B 7/0009
Structural features, others than packages, for protecting a device against environmental influences
Official title: {Structural features, others than packages, for protecting a device against environmental influences (B81C1/00777 takes precedence)}
B81B7/0009 (Structural features, others than packages, for protecting a device against environmental influences) appears on 469 US grants and 581 published applications in this corpus.
Search patents in B81B- Granted patents
- 469
- Published applications
- 581
- Assignees
- 225
- Inventors
- 1,155
- Latest grant
- 8 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1996 | 1 | 0 |
| 1997 | 1 | 0 |
| 1998 | 0 | 0 |
| 1999 | 1 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 2 | 4 |
| 2003 | 1 | 3 |
| 2004 | 8 | 14 |
| 2005 | 10 | 14 |
| 2006 | 8 | 10 |
| 2007 | 5 | 7 |
| 2008 | 4 | 6 |
| 2009 | 11 | 11 |
| 2010 | 4 | 7 |
| 2011 | 9 | 8 |
| 2012 | 8 | 12 |
| 2013 | 10 | 15 |
| 2014 | 8 | 14 |
| 2015 | 27 | 38 |
| 2016 | 18 | 28 |
| 2017 | 23 | 40 |
| 2018 | 30 | 49 |
| 2019 | 51 | 50 |
| 2020 | 52 | 39 |
| 2021 | 34 | 41 |
| 2022 | 38 | 39 |
| 2023 | 36 | 38 |
| 2024 | 25 | 33 |
| 2025 | 27 | 42 |
| 2026 | 17 | 19 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
- B81B 7/0016Protection against shocks or vibrations149
- B81B 7/0029Protection against environmental influences not provided for in groups b81b7/0012 - b81b7/002591
- B81B 7/0025Protection against chemical alteration78
- B81B 7/0019Protection against thermal alteration or destruction60
- B81B 7/0012Protection against reverse engineering, unauthorised use, use in unintended manner, wrong insertion53
- B81B 7/0022Protection against electrostatic discharge33
Recent patents
- Micromechanical arm array for mems actuators8 Sep 2026US 12,729,109 B2Taiwan Semiconductor Manufacturing Company.Ltd
- MEMS device with an improved cap and related manufacturing process8 Sep 2026US 12,729,110 B2STMicroelectronics S,r.l.
- Accelerometer with thermal expansion strain protection25 Aug 2026US 12,715,763 B2Honeywell International Inc.
- Low stress packaging for environmental sensors25 Aug 2026US 12,716,796 B2NXP USA, Inc.
- Spark gaps with high current capability for electrical overstress detection and protection25 Aug 2026US 12,719,242 B2Analog Devices International Unlimited Company
- Micromechanical arm array for mems actuators8 Oct 2026US 2026/0307981 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor device with improved dielectric film structure and method of manufacturing same1 Oct 2026US 2026/0295637 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Mems device1 Oct 2026US 2026/0296877 A1Infineon Technologies AG
- Crash fault mitigation and dust mitigation in mems cooling systems17 Sep 2026US 2026/0274650 A1Frore Systems Inc.
- Bonding pillar structure for hidden comb microelectromechanical system17 Sep 2026US 2026/0280449 A1Lumentum Operations LLC
Most cited
By later US patents
- Encapsulants for protecting MEMS devices during post-packaging release etch116US 6,956,283 B12005
- High energy, low energy density, radiation-resistant optics used with micro-electromechanical devices115US 6,891,655 B2Micronic Laser Systems AB · 2005
- Addressable fuse array for circuits and mechanical devices67US 6,501,107 B1Microsoft Corporation · 2002
- Method of micromachining electromagnetically actuated current switches with polyimide reinforcement seals, and switches produced thereby66US 5,531,018 AGeneral Electric Company · 1996
- Accelerometer transducer used for seismic recording49US 6,883,638 B1Input/Output, Inc. · 2005