Bonding pillar structure for hidden comb microelectromechanical system

A method of manufacturing a microelectromechanical system (MEMS) device, comprising:

• forming, by a device, a stator wafer including a set of stator structures,
• wherein the set of stator structures includes a set of pillars;
• forming, by the device, a rotor wafer including a set of rotor structures,
• wherein the set of rotor structures include a set of bonding pillar areas;
• bonding, by the device, the set of pillars of the stator wafer to the set of bonding pillar areas of the rotor wafer;
• and
• detaching, by the device, the set of bonding pillar areas from the rotor wafer.

An optical system, comprising:

• a microelectromechanical system (MEMS) device, comprising:
• a stator layer, comprising:
• an anchor structure,
• a stator structure attached to the anchor structure, and
• a set of bonding pillars configured to be attached to the anchor structure;
• a rotor layer disposed on the stator layer, comprising:
• a rotor structure,
• a hinge, and
• a set of rotor pillar regions,
• wherein each bonding pillar, of the set of bonding pillars, is configured to be bonded to a respective rotor pillar region of the set of rotor pillar regions;
• and
• a MEMS element disposed above the rotor layer, such that the MEMS element is movable in connection with movement of the rotor layer relative to the stator layer.