Low stress packaging for environmental sensors
AssigneeNXP USA, Inc.
InventorsChayathorn Saklang, Stephen Ryan Hooper, Julien Juéry
Life of this patent
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Abstract
One or more sensor devices are encapsulated on a top surface of a carrier substrate within an elastomer material. The carrier substrate includes one or more recessed channels adjacent to each sensor device which are filled by a portion of the elastomer material to create flanged areas that are level with the top surface of the carrier substrate. A cover which can include a liquid or gas input port or other related structures can be placed over each sensor device and bonded to the carrier substrate at the flanged areas, creating a seal between the cover and the carrier substrate that surrounds each sensor device.
Claims20
A method comprising:
- encapsulating a first sensor device on a top surface of carrier substrate within a volume of elastomer material, wherein the first sensor device is adjacent to a first recessed channel in the carrier substrate;
- wherein the volume of elastomer material has a first height above the carrier substrate in a first region above the first sensor device;
- wherein a portion of the volume of elastomer material fills the first recessed channel and forms a first flanged area that is recessed below the first height in a second region adjacent to the first region;
- and
- wherein the method further comprises bonding a cover to the first flanged area in the second region that overlies the volume of elastomer material such that the cover is separated from the volume of elastomer material by a gap within the first region.
A device comprising:
- a first sensor device disposed on a top surface of carrier substrate adjacent to first recessed channel in the carrier substrate;
- a volume of elastomer material disposed on the carrier substrate that encapsulates the first sensor device;
- and
- a cover disposed above the volume of elastomer material;
- wherein the volume of elastomer material has a first height above the carrier substrate in a first region above the first sensor device;
- wherein a portion of the volume of elastomer material fills the first recessed channel to form a first flanged area that is recessed below the first height in a second region adjacent to the first region;
- and
- wherein the cover is bonded to the first flanged area in the second region that overlies the volume of elastomer material such that the cover is separated from the volume of elastomer material by a gap within the first region.
Dependencies are inferred from the claim text.