B81B 7/0019
Protection against thermal alteration or destruction
Official title: {Protection against thermal alteration or destruction (B81B7/0083 takes precedence)}
B81B7/0019 (Protection against thermal alteration or destruction) appears on 60 US grants and 66 published applications in this corpus.
Search patents in B81B- Granted patents
- 60
- Published applications
- 66
- Assignees
- 49
- Inventors
- 170
- Latest grant
- 25 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2010 | 0 | 1 |
| 2011 | 0 | 0 |
| 2012 | 1 | 1 |
| 2013 | 3 | 1 |
| 2014 | 3 | 0 |
| 2015 | 2 | 5 |
| 2016 | 2 | 3 |
| 2017 | 3 | 6 |
| 2018 | 4 | 8 |
| 2019 | 8 | 4 |
| 2020 | 9 | 7 |
| 2021 | 5 | 6 |
| 2022 | 5 | 4 |
| 2023 | 6 | 11 |
| 2024 | 3 | 3 |
| 2025 | 3 | 5 |
| 2026 | 3 | 1 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- Accelerometer with thermal expansion strain protection25 Aug 2026US 12,715,763 B2Honeywell International Inc.
- Piezoelectric MEMS device with thermal compensation from one or more compensation layers9 Jun 2026US 12,649,653 B2Skyworks Global Pte. Ltd.
- Microelectromechanical devices for higher order passive temperature compensation and methods of designing thereof3 Mar 2026US 12,565,421 B2Stathera IP Holdings Inc.
- Microsystem for measuring rotational movement and measurement device therefor2 Dec 2025US 12,487,070 B2Commissariat A L' Energie Atomique Et Aux Energies Alternatives
- Piezoelectric MEMS device with thermal compensation from different material thicknesses2 Sep 2025US 12,404,167 B2Skyworks Global Pte. Ltd.
- MEMS Sensor Module9 Apr 2026US 2026/0097952 A1Aac Acoustic Technologies (Shenzhen) Co., Ltd.
- Asymmetric filler as temperature transient fix2 Oct 2025US 2025/0304430 A1Rosemount Aerospace Inc.
- Cantilever beam based pressure sensor systems and devices mehthods of use thereof7 Aug 2025US 2025/0250161 A1University of North Texas
- Sensing element and related methods6 Mar 2025US 2025/0076135 A1General Electric Company
- Method for fabricating a microelectronics h-frame device9 Jan 2025US 2025/0011160 A1Northrop Grumman Systems Corporation
Most cited
By later US patents
- Thermally tolerant anchor configuration for a circular cantilever9US 8,564,387 B1RF Micro Devices, Inc. · 2013
- Sensor device packaging9US 8,643,127 B2S3C, Inc. · 2014
- Semiconductor sensing device to minimize thermal noise6US 8,881,596 B2Continental Automotive Systems, Inc. · 2014
- Thermally compensating dieletric anchors for microstructure devices5US 8,570,122 B1RF Micro Devices, Inc. · 2013
- MEMS device connected to a substrate by flexible support structures5US 9,334,153 B1HRL Laboratories, LLC · 2016