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US 9,334,153 B1Granted
MEMS device connected to a substrate by flexible support structures
AssigneeHRL Laboratories, LLC
InventorsRaviv Perahia, Hung Nguyen, Richard J. Joyce
Life of this patent
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Abstract
A MEMS assembly comprising a substrate and a MEMS device; wherein the MEMS device is connected to the substrate by at least two flexible support structures made in a conductive layer formed on a first portion of one of the substrate and the MEMS.
Claims20
A MEMS assembly comprising:
- a substrate;
- and
- a MEMS device;
- wherein the MEMS device is connected to the substrate by at least two flexible support structures made in a conductive layer formed on a first portion of one of said substrate and said MEMS.
1 more element
A method of forming a MEMS assembly comprising:
- providing a substrate;
- providing a MEMS device;
- forming a sacrificial structure on one of said substrate and said MEMS;
- forming a conductive layer on said sacrificial structure and said one of said substrate and said MEMS;
- forming at least two support structures out of said conductive layer;
- assembling said support structures to the other of said one of said substrate and said MEMS;
- and
- removing said sacrificial structure.
5 more elements
Dependencies are inferred from the claim text.