Piezoelectric MEMS device with thermal compensation from one or more compensation layers

Abstract

A system for compensating for thermal stress in piezoelectric microelectromechanical systems devices can have a piezoelectric layer at least partially spanning a cavity such that it generates electrical signals when external forces cause the piezoelectric layer to vibrate with respect to the cavity. At least one electrode layer can include a conductive metal positioned adjacent the piezoelectric layer and configured as an electrode to accept the electrical signals. The piezoelectric layer and electrode layer can have an expected thermal stress tending to cause expected deflection even when external forces are not causing the piezoelectric layer to vibrate. A compensation layer can be positioned adjacent at least one of the piezoelectric layer and the at least one electrode layer and configured to counteract the expected deflection from the expected thermal stress.

Dependencies are inferred from the claim text.