Sensor device packaging
AssigneeS3C, Inc.
InventorsJohn Dangtran, Roger Horton
Life of this patent
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Abstract
A sensor device and a method of forming comprises a die pad receives a sensor device, such as a MEMS device. The MEMS device has a first coefficient of thermal expansion (CTE). The die pad is made of a material having a second CTE compliant with the first CTE. The die pad includes a base and a support structure with a CTE compliant with the first and second CTE. The die pad has a support structure that protrudes from a base. The support structure has a height and wall thickness which minimize forces felt by the die pad and MEMS device when the base undergoes thermal expansion or contraction forces from a header.
Claims18
A sensor device package comprising:
- a header having a first surface and a second surface, the header including a header conduit between the first and second surfaces;
- and
- a die pad having a base and a support structure extending from the base, the support structure to receive a MEMS device thereon, the MEMS device having a first coefficient of thermal expansion (CTE) and the die pad having a second CTE similar to the first CTE, wherein the base of the die pad is hermetically sealed to the header conduit,
- wherein the base and support structure are formed of one piece of the same material and the support structure has a dimension to minimize forces between the header and the die pad when the die pad undergoes thermal expansion or contraction in the header conduit.
Dependencies are inferred from the claim text.