Sensing element and related methods

An apparatus, the apparatus comprising:

• a first acoustic sensing resonator formed from a silicon substrate and having a first microelectromechanical system;
• a second acoustic sensing resonator formed from the silicon substrate and having a second microelectromechanical system, the second acoustic sensing resonator being arranged on the silicon substrate at a ninety degree (90°) angle with respect to the first acoustic sensing resonator so that one of the first acoustic sensing resonator and second acoustic sensing resonator senses compressive forces and the other of the first acoustic sensing resonator and second acoustic sensing resonator senses tensile strain and together the first acoustic sensing resonator and second acoustic sensing resonator form a torque sensor;
• and
• a high temperature bonding surface connected to the torque sensor for directly connecting the torque sensor to a metal object via a high temperature connecting processes comprising at least one of soldering, metalizing, or brazing to form the torque sensor that can withstand prolonged exposure to temperatures of up to three hundred degree Celsius (300° C.).