MEMS Sensor Module

A MEMS sensor module, comprising:

• an inner space enclosed by a side wall;
• a first circuit board disposed on a top of the side wall;
• a second circuit board disposed on a bottom of the side wall;
• a dividing wall disposed in the inner space and connected to the side wall for dividing the inner space into a first cavity and a second cavity;
• a first MEMS sensor disposed in the first cavity, comprising a first ASIC chip mounted on the second circuit board and a first MEMS chip stacked on the first ASIC chip;
• a second MEMS sensor disposed in the second cavity, comprising a second ASIC chip mounted on the first circuit board and a second MEMS chip mounted on the second circuit board;
• a first golden finger layer disposed between the side wall and the first circuit board as well as between the dividing wall and the first circuit board for respectively surrounding the first cavity and the second cavity;
• and
• a second golden finger layer disposed between the side wall and the second circuit board as well as between the dividing wall and the second circuit board for respectively surrounding the first cavity and the second cavity,
• wherein, a first bonding wire connects the first MEMS chip and the second circuit board, a second bonding wire connects the second MEMS chip and the second circuit board, the side wall is provided with a conductor connecting the first circuit board and the second circuit board, a notch communicating the first cavity and the second cavity is provided in the first golden finger layer at the dividing wall and/or the second golden finger layer at the dividing wall.