B81B 7/0025
Protection against chemical alteration
Official title: {Protection against chemical alteration}
B81B7/0025 (Protection against chemical alteration) appears on 78 US grants and 94 published applications in this corpus.
Search patents in B81B- Granted patents
- 78
- Published applications
- 94
- Assignees
- 49
- Inventors
- 222
- Latest grant
- 25 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2005 | 1 | 1 |
| 2006 | 0 | 0 |
| 2007 | 0 | 1 |
| 2008 | 1 | 0 |
| 2009 | 0 | 2 |
| 2010 | 0 | 0 |
| 2011 | 2 | 2 |
| 2012 | 2 | 2 |
| 2013 | 1 | 1 |
| 2014 | 1 | 3 |
| 2015 | 2 | 3 |
| 2016 | 5 | 5 |
| 2017 | 2 | 6 |
| 2018 | 5 | 7 |
| 2019 | 12 | 15 |
| 2020 | 10 | 9 |
| 2021 | 10 | 6 |
| 2022 | 4 | 10 |
| 2023 | 8 | 7 |
| 2024 | 6 | 4 |
| 2025 | 5 | 8 |
| 2026 | 1 | 2 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- Low stress packaging for environmental sensors25 Aug 2026US 12,716,796 B2NXP USA, Inc.
- Wearable device with combined sensing capabilities30 Dec 2025US 12,510,413 B2Pixart Imaging Incorporation
- Corrosion tolerant micro-electromechanical fluid ejection device9 Dec 2025US 12,491,716 B2Hewlett-Packard Development Company, L. P.
- Barrier structure within a microelectronic enclosure23 Sep 2025US 12,421,104 B2Texas Instruments Incorporated
- Semiconductor devices and related methods23 Sep 2025US 12,421,105 B2Amkor Technology Singapore Holding Pte.Ltd.
- Passivation of metal structures for harsh environments20 Aug 2026US 2026/0247880 A1X-FAB Global Services GmbH
- Method for manufacturing an electronic device11 Jun 2026US 2026/0159381 A1Commissariat A L' Energie Atomique Et Aux Energies Alternatives
- Barrier structure within a microelectronic enclosure4 Dec 2025US 2025/0368501 A1Texas Instruments Incorporated
- Mems device and method for fabricating a mems device4 Dec 2025US 2025/0373966 A1Infineon Technologies AG
- Semiconductor devices and related methods23 Oct 2025US 2025/0326632 A1Amkor Technology Singapore Holding Pte.Ltd.
Most cited
By later US patents
- Encapsulants for protecting MEMS devices during post-packaging release etch116US 6,956,283 B12005
- High performance sealed-gap capacitive microphone5US 10,284,963 B22019
- Microfabricated devices and method for fabricating microfabricated devices5US 8,004,021 B2BioScale, Inc. · 2011
- Three-dimensional nanodevices including nanostructures5US 8,263,964 B2Electronics and Telecommunications Research Institute · 2012
- Microphone device with ingress protection4US 11,206,494 B2Knowles Electronics, LLC · 2021