Semiconductor devices and related methods

A method, comprising:

• providing a substrate comprising a substrate top side, a substrate bottom side, and a substrate first interconnect, wherein the substrate first interconnect comprises a substrate first interconnect top side, a substrate first interconnect bottom side, and a substrate first interconnect sidewall that extends between the substrate first interconnect top side and the substrate first interconnect bottom side;
• providing a semiconductor die embedded in the substrate, wherein the semiconductor die comprises a die top side, a die bottom side, and a die sidewall, and wherein the die top side comprises a die first terminal and a die second terminal;
• providing a first internal interconnect that couples the die first terminal to the substrate first interconnect top side;
• providing a micro-electro mechanical system (MEMS) device comprising a device top side, and a device bottom side, wherein the device top side comprises a device first terminal;
• providing an adhesive that contacts the die top side and the device bottom side, wherein the adhesive couples the MEMS device to the semiconductor die;
• and
• providing a second internal interconnect that couples the device first terminal to the die second terminal;
• and
• wherein an encapsulant of the substrate contacts the substrate first interconnect sidewall;
• wherein the encapsulant of the substrate contacts the die sidewall;
• wherein the die top side is uncovered by the encapsulant;
• and
• wherein the MEMS device has a footprint that overlaps a footprint of the semiconductor die.