Encapsulants for protecting MEMS devices during post-packaging release etch
OwnerKenneth A. Petersoninventor
Life of this patent
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Abstract
The present invention relates to methods to protect a MEMS or microsensor device through one or more release or activation steps in a “package first, release later” manufacturing scheme: This method of fabrication permits wirebonds, other interconnects, packaging materials, lines, bond pads, and other structures on the die to be protected from physical, chemical, or electrical damage during the release etch(es) or other packaging steps. Metallic structures (e.g., gold, aluminum, copper) on the device are also protected from galvanic attack because they are protected from contact with HF or HCL-bearing solutions.
Claims15
A microelectronic device, comprising:
- an electrically insulating substrate;
- a first electrical conductor disposed on the substrate;
- a microelectronic device attached to the substrate, wherein the device comprises an active area and a passive area;
- a second electrical conductor disposed on the device, located within the passive area;
- an electrical interconnection formed between the first and second electrical conductors;
- and
- an electrically insulating, protective coating covering the first and second electrical conductors, the electrical interconnection, and the passive area, a portion of the protective coating being removed so as to expose the active area before MEMS elements in the active area being released;
- wherein the thickness of the protective coating is less than or equal to 100 microns.
Dependencies are inferred from the claim text.