Corrosion tolerant micro-electromechanical fluid ejection device
AssigneeHewlett-Packard Development Company, L.P.
InventorsStanley J. Wang, Anthony M. Fuller
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AssigneeHewlett-Packard Development Company, L.P.
InventorsStanley J. Wang, Anthony M. Fuller
Estimating the term…
Aspects of the present disclosure are directed to an apparatus including a circuit region and a fluidic region. In a particular example, the circuit region with logical circuits thereon, includes a thermal oxide layer on a silicon substrate, and a dielectric layer over the field oxide layer, the dielectric layer including a doped dielectric film. The microfluidic device further includes a fluidic region including fluid ports formed through a surface of the apparatus and including an un-doped dielectric film. The fluidic region includes an aperture in the dielectric layer, where the aperture is defined by a dielectric wall which forms part of the dielectric layer. A sealing film deposited over the dielectric wall may prevent the doped dielectric film from contacting fluid contained in the fluid port.
An apparatus comprising:
An apparatus to receive a fluid having corrosive attributes, the apparatus comprising:
An apparatus, comprising:
Dependencies are inferred from the claim text.