MEMS device with an improved cap and related manufacturing process

A device, comprising:

• an electronic device including:
• a MEMS sensor device including a functional structure configured to, in operation, transduce a chemical or physical quantity into a corresponding electrical quantity;
• a first semiconductive device including a first semiconductive substrate and an insulating region on the first semiconductive substrate, wherein the first semiconductive device further includes a first recess and the first recess is overlapped by the functional structure of the MEMS sensor device;
• a cap including:
• a second semiconductive substrate;
• a second recess that extends into the second semiconductive substrate and overlaps the functional structure and overlaps the first recess;
• and
• a conductive region that extends between the second semiconductive substrate and the MEMS sensor device, the conductive region including:
• a first portion that is arranged laterally with respect to the second semiconductive substrate and is exposed;
• and
• a second portion that is in contact with the second semiconductive substrate;
• a bonding dielectric region mechanically couples the cap to the MEMS sensor device;
• a semiconductive die coupled to the electronic device by an adhesive layer between the electronic device and the semiconductive die;
• a support coupled to a surface of the semiconductive die facing away from the electronic device;
• a package dielectric region on the support, on the semiconductive die, and on the electronic device, and
• wherein the electronic device includes a surface that is exposed from the package dielectric region.

A device, comprising:

• a first substrate including a first surface and a second surface opposite to the first surface;
• an insulating region on the first surface of the first substrate, the insulating region including a third surface facing away from the first substrate;
• a conductive path in the insulating region;
• a window extends into the insulating region to the conductive path;
• a first cavity within the insulating region, wherein the first cavity is along the third surface of the insulating region, and the first cavity is spaced apart from the window and the conductive path;
• a structural layer coupled to third surface of the insulating region, the structural layer including:
• a fourth surface facing away from the insulating region;
• a first main portion on the third surface of the insulating region, the first main portion includes a movable mass that is suspended over the first cavity, wherein the movable mass overlaps the first cavity within the insulating region;
• a portion on the third surface, wherein the portion extends through the window and the portion is on and coupled to the conductive path;
• at least one opening that extends through the structural layer and separates the first main portion of the structural layer form the portion of the structural layer;
• a conductive pad on the portion of the structural layer;
• a bonding layer on the first main portion and along the fourth surface of the structural layer;
• a first dielectric region on the bonding layer;
• a second dielectric region on the first dielectric region;
• a second substrate coupled to the second dielectric region, wherein the second substrate includes a second cavity that is aligned with and overlaps the moveable mass, and wherein the second cavity is aligned with and overlaps the first cavity within the insulating region;
• a conductive region including:
• a first secondary portion that extends through the second dielectric region and is exposed from the second dielectric region;
• a second secondary portion that extends through the second dielectric region and is exposed from the second dielectric region, and the second secondary portion is spaced apart from the first secondary portion;
• and
• a second main portion is between the first dielectric region and the second dielectric region, and the second main portion extends from the first secondary portion to the second secondary portion.