B81B 7/02
Containing distinct electrical or optical devices of particular relevance for their function
Official title: containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS] (B81B7/04 takes precedence)
B81B7/02 (Containing distinct electrical or optical devices of particular relevance for their function) appears on 880 US grants and 1,110 published applications in this corpus.
Search patents in B81B- Granted patents
- 880
- Published applications
- 1,110
- Assignees
- 371
- Inventors
- 1,977
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2002 | 0 | 2 |
| 2003 | 0 | 0 |
| 2004 | 1 | 1 |
| 2005 | 1 | 4 |
| 2006 | 2 | 2 |
| 2007 | 1 | 4 |
| 2008 | 2 | 9 |
| 2009 | 2 | 10 |
| 2010 | 2 | 12 |
| 2011 | 9 | 13 |
| 2012 | 17 | 19 |
| 2013 | 16 | 31 |
| 2014 | 20 | 55 |
| 2015 | 45 | 84 |
| 2016 | 50 | 83 |
| 2017 | 87 | 83 |
| 2018 | 74 | 87 |
| 2019 | 88 | 125 |
| 2020 | 96 | 93 |
| 2021 | 79 | 68 |
| 2022 | 65 | 85 |
| 2023 | 67 | 80 |
| 2024 | 58 | 65 |
| 2025 | 63 | 63 |
| 2026 | 35 | 32 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- Circuit for operating a capacitive sensor and sensor apparatus6 Oct 2026US 12,754,221 B2Robert Bosch GmbH
- System and method for generating an audio signal6 Oct 2026US 12,756,970 B2Sonicedge Ltd.
- MEMS device with integrated CMOS circuit8 Sep 2026US 12,729,111 B23C Project Management Limited
- Normally-open piezoelectric MEMS valve8 Sep 2026US 12,729,781 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Method for bonding a microelectromechanical device18 Aug 2026US 12,709,539 B2Murata Manufacturing Co., Ltd.
- Wafer level proximity sensor and method of making same1 Oct 2026US 2026/0296880 A1STMicroelectronics International N. V.
- Integrated device and manufacturing method thereof24 Sep 2026US 2026/0285673 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Failsafe ohmic-capacitive membrane actuator-based radio frequency switch24 Sep 2026US 2026/0290713 A1Dell Products L. P.
- Sound Producing Device and Sound Producing Package17 Sep 2026US 2026/0274652 A1xMEMS Labs, Inc.
- Mems microphone and mems accelerometer on a single substrate27 Aug 2026US 2026/0250120 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- Vertical system integration289US 7,402,897 B2Elm Technology Corporation · 2008
- Planar microshells for vacuum encapsulated devices and damascene method of manufacture94US 7,923,790 B1Silicon Laboratories Inc. · 2011
- Integrated MEMS devices with controlled pressure environments by means of enclosed volumes68US 8,350,346 B1InvenSense, Inc. · 2013
- MEMS integrated pressure sensor devices and methods of forming same66US 9,040,334 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015
- Composite sensor device and method of producing the same64US 7,004,025 B2Murata Manufacturing Co., Ltd. · 2006