MEMS device with integrated CMOS circuit

A method of manufacturing a Micro-Electro-Mechanical Systems, MEMS device, the MEMS device comprising a movable Micro-Electro-Mechanical piezoelectric component and a CMOS circuit configured to be in conductive communication with the Micro-Electro-Mechanical component, the method comprising:

• forming a plurality of CMOS circuit layers on a substrate to form the CMOS circuit, the plurality of CMOS circuit layers comprising a plurality of CMOS passivation and metallisation layers;
• removing a portion of at least one of the plurality of CMOS passivation and metallisation layers in a component region of the device;
• and
• forming one or more component region layers in place of the removed portion in the component region to form the movable Micro-Electro-Mechanical piezoelectric component, the one or more component region layers different from the portion of the at least one of the plurality of CMOS circuit layers,
• wherein forming the one or more component region layers comprises depositing a MEMS passive layer in place of the removed portion, and
• wherein the MEMS passive layer overlays the plurality of CMOS passivation and metallisation layers in the CMOS circuit region.

A Micro-Electro-Mechanical Systems, a MEMS device comprising:

• a substrate having a CMOS circuit integrally provided therewith, the CMOS circuit being formed by a plurality of CMOS circuit layers including a plurality of CMOS passivation and metallisation layers, and arranged in a CMOS circuit region of the MEMS device;
• and
• a movable Micro-Electro-Mechanical piezoelectric component configured to be controlled by the CMOS circuit and arranged in a component region of the MEMS device, the component region distinct from the CMOS circuit region,
• wherein the component region comprises one or more component region layers including the Micro-Electro-Mechanical piezoelectric component,
• wherein the or each of the one or more component region layers in the component region is different from each of the plurality of CMOS passivation and metallisation layers, of the CMOS circuit region,
• wherein a one of the one or more component region layers is a MEMS passive layer, wherein the MEMS passive layer overlays the plurality of CMOS passivation and metallisation layers in the CMOS circuit region,
• wherein the Micro-Electro-Mechanical component is deposited on the MEMS passive layer,
• wherein a one of the plurality of CMOS passivation and metallisation layers is formed on a first surface of the substrate, and
• wherein in the component region, the one or more component region layers extend to be planar with the first surface.

A Micro-Electro-Mechanical Systems, a MEMS device comprising:

• a substrate having a CMOS circuit integrally provided therewith, the CMOS circuit being formed by a plurality of CMOS circuit layers including a plurality of CMOS passivation and metallisation layers, together extending between a first plane defined between a one of the plurality of CMOS passivation and metallisation layers bordering the substrate and the substrate, and a second plane defined parallel to the first plane and by a furthest one of the plurality of CMOS passivation and metallisation layers, and arranged in a CMOS circuit region of the MEMS device;
• and
• a movable Micro-Electro-Mechanical piezoelectric component configured to be controlled by the CMOS circuit and arranged in a component region of the MEMS device, the component region distinct from the CMOS circuit region,
• wherein the component region comprises one or more component region layers including the Micro-Electro-Mechanical piezoelectric component, at least one of the one or more component region layers extending to the first plane in a direction from the second plane to the first plane, and
• wherein the at least one of the one or more component region layers extending to the first plane is formed from a material different from the one of the plurality of CMOS passivation and metallisation layers bordering the substrate,
• wherein a one of the one or more component region layers is a MEMS passive layer, and
• wherein the Micro-Electro-Mechanical component is deposited on the MEMS passive layer.